Substrate processing apparatus

ABSTRACT

Substrate processing apparatus having a transport chamber, a linear array of substrate holding modules alongside the transport chamber, and a substrate transport located in the chamber. The chamber can hold an isolated atmosphere, and defines more than one substantially linear transport paths extending longitudinally along the transport chamber. The transport in the chamber is capable of transporting the substrate along the linear transport paths. The transport has a transporter capable of holding and moving the substrate. The transporter interfaces a wall of the transport chamber for moving along at least one of linear paths. The transport chamber has interfaces for mating with other substrate holding modules at opposite ends of the transport chamber. Each interface has an opening through which at least one of the more than one linear transport paths extends, and the transport chamber has a selectably variable longitudinal length between the interfaces.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation-in-part of application Ser. No. 10/962,787, filedOct. 9, 2004, that is a continuation in part of application Ser. No.10/624,987, filed Jul. 22, 2003, now U.S. Pat. No. 7,575,406 that claimsthe benefit of U.S. Provisional Application No. 60/397,895, filed Jul.22, 2002, which is incorporated by reference herein in its entirety.

BACKGROUND INFORMATION

1. Field

The embodiments and methods described herein relate to substrateprocessing apparatus and, more particularly, to substrate processingapparatus with chambers interconnected in a Cartesian arrangement.

2. Brief Description of Earlier Developments

One of the factors affecting consumer desire for new electronic devicesnaturally is the price of the device. Conversely, if the cost, and hencethe price of new electronic devices can be lowered, it would appear thata beneficial effect would be achieved in consumer desires for newelectronic devices. A significant portion of the manufacturing costs forelectronic devices is the cost of producing the electronics which startswith the manufacturing and processing of semi-conductor substrates suchas used in manufacturing electronic components, or panels used formaking displays. The cost of processing substrates is affected in partby the cost of the processing apparatus, the cost of the facilities inwhich the processing apparatus are housed, and in large part by thethroughput of the processing apparatus (which has significant impact onunit price). As can be immediately realized, the size of the processingapparatus itself impacts all of the aforementioned factors. However, itappears that conventional processing apparatus have reached a dead endwith respect to size reduction. Moreover, conventional processingapparatus appear to have reached a limit with respect to increasingthroughput per unit. For example, conventional processing apparatus mayuse a radial processing module arrangement. A schematic plan view of aconventional substrate processing apparatus is shown in FIG. 1. As canbeen seen, the processing modules of the apparatus in FIG. 1 are placedradially around the transport chamber of the processing apparatus. Thetransport apparatus, which is a conventional two or three axis ofmovement apparatus (e.g. Z, θ, T Axis) is centrally located in thetransport chamber to transport substrates between processing modules. Ascan be realized from FIG. 1, throughput of the conventional processingapparatus is limited by the handling rate of the transport apparatus. Inother words, throughput cannot be increased with the conventionalapparatus by merely adding processing modules to the apparatus, becauseonce the transport apparatus reaches a handling rate peak, this becomesthe controlling factor for throughput. The apparatus of the presentinvention overcome the problems of the prior art as will be describedfurther below.

SUMMARY OF THE EMBODIMENTS AND METHODS

In accordance with one exemplary embodiment, a substrate processingapparatus is provided. The substrate processing apparatus comprising atransport chamber, a generally linear array of substrate holding modulesalongside the transport chamber, and a substrate transport located inand movably mounted to the transport chamber. The transport chamber iscapable of holding an isolated atmosphere isolated from an outsideatmosphere. The chamber defines more than one substantially lineartransport paths extending longitudinally along the transport chamberbetween opposing walls of the transport chamber. Each holding module ofthe linear array alongside the transport chamber is communicablyconnected to the chamber to allow passage of a substrate betweentransport chamber and holding module. The substrate transport located inthe transport chamber is capable of transporting the substrate along themore than one substantially linear transport paths. The substratetransport has at least one transporter capable of holding and moving thesubstrate. The transporter translatably interfaces a wall of thetransport chamber for moving along at least one of linear transportpaths. The transport chamber has interfaces for mating with othersubstrate holding modules at opposite ends of the transport chamber.Each interface has an opening through which at least one of the morethan one linear transport paths extends, and the transport chamber has aselectably variable longitudinal length between the interfaces.

In accordance with another exemplary embodiment, a substrate processingapparatus is provided. The apparatus comprises a transport chamber, agenerally linear array of substrate holding modules alongside thetransport chamber, and a substrate transport located in and movablymounted to the transport chamber for transporting the substrate. Thetransport chamber defines more than one substantially linear transportpaths extending longitudinally along the transport chamber betweenopposing walls of the transport chamber. Each of the modules in thelinear array is communicably connected to the chamber to allow passageof a substrate between transport chamber and holding module. Thesubstrate transport is capable of transporting the substrate along themore than one substantially linear transport paths. The substratetransport has at least one transporter capable of holding and moving thesubstrate on the linear transport paths. The transport chamber comprisesdifferent transport tubes. Each of the different transport tubes has atleast one of the transport paths located therein different from anotherof the transport paths located in another of the transport tubes, and iscommunicably connected to another transport tube at a first location toallow substrate transfer between different transport paths in differenttransport tubes. Each transport tube extends longitudinally to anotherlocation common to each transport tube and distant from the firstlocation. At least one of the transport tubes is capable of holding anisolated atmosphere therein.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the present invention areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1 is a schematic plan view of a substrate processing apparatus inaccordance with the prior art;

FIG. 2 is a schematic plan view of a substrate processing apparatusincorporating features of the present invention in accordance with afirst embodiment;

FIG. 3 is a schematic plan view of a substrate processing apparatus inaccordance with another embodiment of the present invention;

FIGS. 4-5 are respectively schematic plan views of substrate processingapparatus in accordance with still other embodiments of the presentinvention;

FIG. 6 is a schematic plan view of a substrate processing apparatus inaccordance with yet another embodiment of the present invention;

FIG. 7 is a schematic plan view of a substrate processing system withtwo substrate processing apparatus in accordance with anotherembodiment, and FIG. 7A is another schematic plan view of the substrateprocessing system in accordance with yet another embodiment;

FIG. 8 is a schematic plan view of another conventional substrateprocessing apparatus;

FIG. 9 is a schematic plan view of a conventional substrate processingsystem including a number of conventional processing apparatus and astocker;

FIG. 10 is an end view of a platen drive system of the substrateprocessing apparatus;

FIGS. 11A-11B are respectively an end view, and a section view (takenalong lines 11B-11B in FIG. 11A) of another platen drive system of thesubstrate processing apparatus;

FIG. 12 is a top view of an exemplary cart of the substrate processingapparatus in accordance with another embodiment of the apparatus;

FIG. 12A is another top view of the exemplary cart in FIG. 12 with thecart shown in an extended position;

FIG. 12B is an end view of the exemplary cart in FIG. 12 in a portion ofa chamber of the apparatus;

FIG. 13A is a top end view of a portion of a chamber of the apparatuswith a drive system and transport cart in accordance with anotherembodiment of the apparatus;

FIG. 13B-13C respectively are a section view of the chamber and carttaken along lines 13B-13B in FIG. 13A, and another section view takenalong lines 13C-13C in FIG. 13B;

FIG. 13D is a schematic diagram of an exemplary drive system of theapparatus;

FIG. 14A is an end view of another embodiment of a cart used with theapparatus in FIG. 2;

FIG. 14B is a graph illustrating the relationship between axialdeflection Z and a restoring force F of the drive system;

FIGS. 15-16 are respectively a schematic perspective view and anexploded elevation view of semiconductor workpiece transport cart of theapparatus in accordance with another embodiment;

FIG. 17 is a schematic perspective view of the transport cart inaccordance with another embodiment;

FIG. 18 is a cross-section of a portion of the transport apparatus inFIG. 2 and a workpiece chuck rotation device of the apparatus;

FIGS. 19-20 respectively are elevation views of the workpiece chuckrotation device and a transport cart of the apparatus with the transportcart in different positions;

FIG. 21 is another schematic elevation of the chuck rotation device inaccordance with yet another embodiment; and

FIGS. 22-23 respectively are a schematic top plan view and schematicelevation view of yet another embodiment of the transport cart for theapparatus;

FIGS. 23A-23B respectively are other top plan views of the transportcart in FIG. 22 with a transfer arm of the cart in two differentpositions;

FIG. 24 is a schematic elevation view of another embodiment of thetransport cart;

FIGS. 24A-24C respectively are plan views of the transport cart in FIG.24 with the transport arm linkage of the cart in three differentpositions;

FIG. 25 is a schematic elevation view of still another embodiment of thetransport cart;

FIGS. 25A-25C respectively are plan views of the transport cart in FIG.25 with the transport arm linkage of the cart in three differentpositions;

FIG. 26 is a schematic diagram of system control software in thecontroller of the apparatus.

FIG. 27 is a schematic plan view of a substrate processing system inaccordance with yet another exemplary embodiment of the invention;

FIG. 28 is a cross-sectional elevation view of a representative moduleof a transport chamber of the system in FIG. 27;

FIG. 29 is a cross-sectional view of the chamber module taken along line29-29 in FIG. 28;

FIG. 30 is a bottom view of a substrate transport of the system in FIG.27.

FIG. 31 is another schematic plan view of a processing apparatus inaccordance with another exemplary embodiment;

FIG. 32 is a schematic elevation view of a representative portion of aprocessing apparatus in accordance with another exemplary embodiment;and

FIG. 33 is another schematic elevation view of a representative portionof a processing apparatus in accordance with still another exemplaryembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Referring to FIG. 2, there is shown a schematic plan view of a substrateprocessing apparatus 10 incorporating features of the present invention.Although the present invention will be described with reference to theembodiments shown in the drawings, it should be understood that thepresent invention can be embodied in many alternate forms ofembodiments. In addition, any suitable size, shape or type of elementsor materials could be used.

The substrate processing apparatus 10 is connected to an environmentalfront end module (EFEM) 14 which has a number of load ports 12 as shownin FIG. 2. The load ports 12 are capable of supporting a number ofsubstrate storage canisters such as for example conventional FOUPcanisters; though any other suitable type may be provided. The EFEM 14communicates with the processing apparatus through load locks 16 whichare connected to the processing apparatus as will be described furtherbelow. The EFEM 14 (which may be open to atmosphere) has a substratetransport apparatus (not shown) capable of transporting substrates fromload ports 12 to load locks 16. The EFEM 14 may further includesubstrate alignment capability, batch handling capability, substrate andcarrier identification capability or otherwise. In alternateembodiments, the load locks 16 may interface directly with the loadports 12 as in the case where the load locks have batch handlingcapability or in the case where the load locks have the ability totransfer wafers directly from the FOUP to the lock. Some examples ofsuch apparatus are disclosed in U.S. Pat. Nos. 6,071,059, 6,375,403,6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472,6,120,229 and U.S. patent application Ser. No. 10/200,818 filed Jul. 22,2002 all of which are incorporated by reference herein in theirentirety. In alternate embodiments, other lock options may be provided.

Still referring to FIG. 2, the processing apparatus 10, which as notedbefore may be used for processing semiconductor substrates (e.g. 200/300mm wafers), panels for flat panel displays, or any other desired kind ofsubstrate, generally comprises transport chamber 18, processing modules20, and at least one substrate transport apparatus 22. The substratetransport apparatus 22 in the embodiment shown is integrated with thechamber 18. In this embodiment, processing modules are mounted on bothsides of the chamber. In other embodiments, processing modules may bemounted on one side of the chamber as shown for example in FIG. 4. Inthe embodiment shown in FIG. 2, processing modules 20 are mountedopposite each other in rows Y1, Y2 or vertical planes. In otheralternate embodiments, the processing modules may be staggered from eachother on the opposite sides of the transport chamber or stacked in avertical direction relative to each other. The transport apparatus 22has a cart 22C that is moved in the chamber to transport substratesbetween load locks 16 and the processing chambers 20. In the embodimentshown, only one cart 22C is provided, in alternate embodiments, morecarts may be provided. As seen in FIG. 2, the transport chamber 18(which is subjected to vacuum or an inert atmosphere or simply a cleanenvironment or a combination thereof in its interior) has aconfiguration, and employs a novel substrate transport apparatus 22 thatallows the processing modules to be mounted to the chamber 18 in a novelCartesian arrangement with modules arrayed in substantially parallelvertical planes or rows. This results in the processing apparatus 10having a more compact footprint than a comparable conventionalprocessing apparatus (i.e. a conventional processing apparatus with thesame number of processing modules) as is apparent from comparing FIGS. 1and 2. Moreover, the transport chamber 22 may be capable of beingprovided with any desired length to add any desired number of processingmodules, as will be described in greater detail below, in order toincrease throughput. The transport chamber may also be capable ofsupporting any desired number of transport apparatus therein andallowing the transport apparatus to reach any desired processing chamberon the transport chamber without interfering with each other. This ineffect decouples the throughput of the processing apparatus from thehandling capacity of the transport apparatus, and hence the processingapparatus throughput becomes processing limited rather than handlinglimited. Accordingly, throughput can be increased as desired by addingprocessing modules and corresponding handling capacity on the sameplatform.

Still referring to FIG. 2, the transport chamber 18 in this embodimenthas a general rectangular shape though in alternate embodiments thechamber may have any other suitable shape. The chamber 18 has a slendershape (i.e. length much longer than width) and defines a generallylinear transport path for the transport apparatus therein. The chamber18 has longitudinal side walls 18S. The side walls 18S have transportopenings or ports 18O formed therethrough. The transport ports 18O aresized large enough to allow substrates to pass through the ports (can bethrough valves) into and out of the transport chamber. As can be seen inFIG. 2, the processing modules 20 in this embodiment are mounted outsidethe side walls 18 s with each processing module being aligned with acorresponding transport port in the transport chamber. As can berealized, each processing module 20 may be sealed against the sides 18Sof the chamber 18 around the periphery of the corresponding transportaperture to maintain the vacuum in the transport chamber. Eachprocessing module may have a valve, controlled by any suitable means toclose the transport port when desired. The transport ports 18O may belocated in the same horizontal plane. Accordingly, the processingmodules on the chamber are also aligned in the same horizontal plane. Inalternate embodiments the transport ports may be disposed in differenthorizontal planes. As seen in FIG. 2, in this embodiment, the load locks16 are mounted to the chamber sides 18S at the two front most transportports 18O. This allows the load locks to be adjacent the EFEM 14 at thefront of the processing apparatus. In alternate embodiments, the loadlocks may be located at any other transport ports on the transportchamber such as shown for example in FIG. 4. The hexahedron shape of thetransport chamber allows the length of the chamber to be selected asdesired in order to mount as many rows of processing modules as desired(for example see FIGS. 3, 5, 6-7A showing other embodiments in which thetransport chamber length is such to accommodate any number of processingmodules).

As noted before, the transport chamber 18 in the embodiment shown inFIG. 2 has one substrate transport apparatus 22 having a single cart22C. The transport apparatus 22 is integrated with the chamber totranslate cart 22C back and forth in the chamber between front 18F andback 18B. The transport apparatus 22 has cart 22C having end effectorsfor holding one or more substrates. The cart 22C of transport apparatus22 also has an articulated arm or movable transfer mechanism 22A forextending and retracting the end effectors in order to pick or releasesubstrates in the processing modules or load locks. To pick or releasesubstrates from the processing modules/load ports, the transportapparatus 22 may be aligned with desired module/port and the arm isextended/retracted through the corresponding port 18O to position theend effector inside the module/port for the substrate pick/release.

The transport apparatus 22, shown in FIG. 2 is a representativetransport apparatus and, includes a cart 22C which is supported fromlinear support/drive rails. The transport apparatus will be described ingreater detail below. The linear support/drive rails may be mounted tothe side walls 18S, floor, or top of the transport chamber and mayextend the length of the chamber. This allows the cart 22C, and hence,the apparatus to traverse the length of the chamber. The cart has aframe, which supports the arm. The frame also supports caster mounts orplatens 22B, which move with or relative to the frame. As will also bedescribed further below, a sequential synchronous linear motor 30 drivesthe platens 22B and hence the cart 22C along the rails. The linear motor30 may be located in the floor or side walls 18S of the transportchamber. A barrier, as will be seen further below, may be locatedbetween the windings of the motor and the motive portion of the platensto isolate the windings from the interior of the chamber. In general,the linear motor may include a number of drive zones. The drive zonesare located at locations along the transport chamber where the arm 22Ais extended/retracted (i.e. at the rows YO-Y2 in this embodiment ofmodules/ports). The number and density of drive zones is dependent onthe number of platens per cart, the number of motors per chamber, thenumber of process modules or exchange points etc. In this embodiment,the arm is operably connected to the platens 22A by a suitablelinkage/transmission so that when the platens are moved by a drive motorin relative motion to each other the arm is extended or retracted. Forinstance, the transmission may be arranged so that when the platens aremoved apart along the rails the arm is extended to the left, and whenmoved back closer together the arm is retracted from the left. Theplatens may also be suitably operated by a linear motor toextend/retract the arm 22A to/from the right. The control of movement ofthe platens over the slide rails with the linear motor, as well asposition sensing of the platens and hence of the cart and theextended/retracted position of the arm may be accomplished in accordancewith international application having publication numbers WO 99/23504;99/33691; 01/02211; 01/38124; and 01/71684, which are incorporated byreference herein in their entireties. As can be realized, the platensmay be driven in unison in one direction in order to move the entirecart/apparatus in that longitudinal direction inside the transportchamber.

FIG. 3 shows another embodiment of a substrate processing apparatus 10′which is generally similar to apparatus 10. In this embodiment, thetransport chamber 18′ has two transport apparatus 22A, 22B. Thetransport apparatus 122A, 122B are substantially the same as theapparatus 22 in the previously described embodiment. Both transportapparatus 122A, 122B may be supported from a common set of longitudinalslide rails as described before. The platens of the cart correspondingto each apparatus may be driven by the same linear motor drive. Thedifferent drive zones of the linear motor allow the independent drivingof individual platens on each cart and thus also the independent drivingof each individual cart 122A, 122B. Thus, as can be realized the arm ofeach apparatus can be independently extended/retracted using the linearmotor in a manner similar to that described before. However, in thiscase the substrate transport apparatus 122A, 122B are not capable ofpassing each other in the transport chamber unless separate slidesystems are employed. Accordingly, the processing modules are positionedalong the length of the transport chamber so that the substrate may betransported to be processed in the processing module in a sequence whichwould avoid the transport apparatus from interfering with each other.For example, processing modules for coating may be located beforeheating modules, and cooling modules and etching modules may be locatedlast.

However, the transport chamber 18′ may have another transport zone 18′A,18′B which allow the two transport apparatus to pass over each other(akin to a side rail, bypass rail or magnetically suspended zone thatdoes not require rails). In this case, the other transport zone may belocated either above or below the horizontal plane(s) in which theprocessing modules are located. In this embodiment the transportapparatus has two slide rails, one for each transport apparatus. Oneslide rail may be located in the floor, or side walls of the transportchamber, and the other slide rail may be located in the top of thechamber. In alternate embodiments, a linear drive system may be employedwhich simultaneously drives and suspends the carts where the carts maybe horizontally and vertically independently moveable, hence allowingthem independent of each other to pass or transfer substrates. In allembodiments employing electric windings, these windings may also be usedas resistance heaters as in the case where it is desired that thechamber be heated for degas as in the case to eliminate water vapor forexample. Each transport apparatus in this case may be driven by adedicated linear drive motor or a dedicated drive zone in which the cartresides similar to that described before.

Referring now to FIGS. 6, and 7 there are shown other substrateprocessing apparatus in accordance with other embodiments of the presentinvention. As seen in FIGS. 6 and 7 the transport chamber in theseembodiments is elongated to accommodate additional processing modules.The apparatus shown in FIG. 6 has twelve (12) processing modulesconnected to the transport chamber, and each apparatus (two apparatusare shown) in FIG. 7 has 24 processing module connected to the transportchamber. The numbers of processing modules shown in these embodimentsare merely exemplary, and the apparatus may have any other number ofprocessing modules as previously described. The processing modules inthese embodiments are disposed along the sides of the transport chamberin a Cartesian arrangement similar to that previously discussed. Thenumber of rows of processing modules in these case however have beengreatly increased (e.g. six (6) rows in the apparatus of FIG. 6, andtwelve (12) rows in each of the apparatus of FIG. 7). In the embodimentof FIG. 6, the EFEM may be removed and the load ports may be mateddirectly to load locks. The transport chamber of the apparatus in FIGS.6, and 7 have multiple transport apparatus (i.e. three apparatus in thecase of FIG. 6, and six apparatus in the case of FIG. 7) to handle thesubstrates between the load locks and the processing chambers. Thenumber of transport apparatus shown are merely exemplary and more orfewer apparatus may be used. The transport apparatus in theseembodiments are generally similar to that previously described,comprising an arm and a cart. In this case, however, the cart issupported from zoned linear motor drives in the side walls of thetransport chamber. The linear motor drives in this case provide fortranslation of the cart in two orthogonal axis (i.e. longitudinally inthe transport chamber and vertically in the transport chamber).Accordingly, the transport apparatus are capable of moving past oneanother in the transport chamber. The transport chamber may have“passing” or transport areas above and/or below the plane(s) of theprocessing modules, through which the transport apparatus may be routedto avoid stationary transport apparatus (i.e. picking/releasingsubstrates in the processing modules) or transport apparatus moving inopposite directions. As can be realized, the substrate transportapparatus has a controller for controlling the movements of the multiplesubstrate transport apparatus.

Still referring to FIG. 7, the substrate processing apparatus 18A and18B in this case may be mated directly to a tool 300.

As may be realized from FIGS. 3, 5 and 6-7 the transport chamber 18 maybe extended as desired to run throughout the processing facility P. Asseen in FIG. 7, and as will be described in further detail below, thetransport chamber may connect and communicate with various sections orbays, 18A, 18B in the processing facility P such as for example storage,lithography tool, metal deposition tool or any other suitable tool bays.Bays interconnected by the transport chamber 18 may also be configuredas process bays or processes 18A, 18B. Each bay has desired tools (e.g.lithography, metal deposition, heat soaking, cleaning) to accomplish agiven fabrication process in the semiconductor workpiece. In eithercase, the transport chamber 18 has processing modules, corresponding tothe various tools in the facility bays, communicably connected thereto,as previously described, to allow transfer of the semiconductorworkpiece between chamber and processing modules. Hence, the transportchamber may contain different environmental conditions such asatmospheric, vacuum, ultra high vacuum, inert gas, or any other,throughout its length corresponding to the environments of the variousprocessing modules connected to the transport chamber. Accordingly, thesection 18P1 of the chamber in a given process or bay 18A, 18B, orwithin a portion of the bay, may have for example, one environmentalcondition (e.g. atmospheric), and another section 18P2, 18P3 of thechamber may have a different environmental condition. As noted before,the section 18P1, 18P2, 18P3 of the chamber with different environmentstherein may be in different bays of the facility, or may all be in onebay of the facility. FIG. 7 shows the chamber 18 having three sections18P1, 18P2, 18P3 with different environments for example purposes only.The chamber 18 in this embodiment may have as many sections with as manydifferent environments as desired.

As seen in FIG. 7, the transport apparatus, similar to apparatus 122A,(see also FIG. 3) in the chamber 18 are capable of transiting betweensections 18P1, 18P2, 18P3 of the chamber with different environmentstherein. Hence, as can be realized from FIG. 7, the transport apparatus122A may with one pick move a semiconductor workpiece from the tool inone process or bay 18A of the processing facility to another tool with adifferent environment in a different process or bay 18B of the processfacility. For example, transport apparatus 122A may pick a substrate inprocessing module 301, which may be an atmospheric module, lithography,etching or any other desired processing module in section 18P1, oftransport chamber 18. The transport apparatus 122A may then move in thedirection indicated by arrow X3 in FIG. 7 from section 18P1 of thechamber to section 18P3. In section 18P3, the transport apparatus 122Amay place the substrate in processing module 302, which may be anydesired processing module.

As can be realized from FIG. 7, the transport chamber may be modular,with chamber modules connected as desired to form the chamber 18. Themodules may include internal walls 18I, similar to walls 18F, 18R inFIG. 2, to segregate sections 18P1, 18P2, 18P3, 18P4 of the chamber.Internal walls 18I may include slot valves, or any other suitable valveallowing one section of the chamber 18P1, 18P4 to communicate withadjoining section. The slot valves 18V, may be sized to allow, one ormore carts to transit through the valves from one section 18P1, 18P4 toanother. In this way, the carts 122A may move anywhere throughout thechamber 18. The valves may be closed to isolate sections 18P1, 18P2,18P3, 18P4 of the chamber so that the different sections may containdisparate environments as described before. Further, the internal wallsof the chamber modules may be located to form load locks 18P4 as shownin FIG. 2. The load locks 18P4 (only one is shown in FIG. 2 for examplepurposes) may be located in chamber 18 as desired and may hold anydesired number of carts 122A therein.

In the embodiment shown in FIG. 7, processes 18A and 18B may be the sameprocess, for example etch, where the processing apparatus 18A and 18B incombination with tool 300 being a stocker are capable of processingequal amounts of substrates as, for example the apparatus shown in FIG.9 but without the associated material handling overhead associated withtransporting FOUPS from the stocker to individual process tools via anAMHS, and transporting individual wafers via EFEM's to the respectiveprocessing tools. Instead, the robot within the stocker directlytransfers FOUPS to the load ports (3 shown per tool, more or less couldbe provided depending on throughput requirements) where the wafers arebatch moved into locks and dispatched to their respective processmodule(s) depending on the desired process and/or throughput required.In this manner, in a steady state fashion, the FIG. 7 apparatus and FIG.9 apparatus may have the same throughput, but the apparatus in FIG. 7does it with less cost, lower footprint, less WIP required—therefor lessinventory and with a quicker turnaround when looking at the time toprocess a single carrier lot (or “hot lot”) resulting in significantadvantages for the fab operator. Within the tool 18A, 18B or the stocker300 may further have metrology capability, sorting capability, materialidentification capability, test capability, inspection capability (putboxes . . . ) etc. as required to effectively process and testsubstrates.

In the embodiment shown in FIG. 7, more or less processes 18A and 18Bmay be provided that are different processes, for example etch, CMP,copper deposition, PVD, CVD, etc. where the processing apparatus 18A,18B, etc. in combination with tool 300 being, for example aphotolithography cell are capable of processing equal amounts ofsubstrates as, for example multiple apparatus' shown in FIG. 9 butwithout the associated material handling overhead associated withtransporting FOUPs from stockers to individual process tool bays and alithography bay via an AMHS, and transporting individual wafers viaEFEM's to the respective processing tools. Instead, the automationwithin the lithography cell directly transfers FOUPS, substrates ormaterial to the load ports (3 shown per process type, more or less couldbe provided depending on throughput requirements) where the substratesare dispatched to their respective process depending on the desiredprocess and/or throughput required. An example of such an alternative isshown in FIG. 7A. In this manner, the apparatus in FIG. 7 processessubstrates with less cost, lower footprint, less WIP required—thereforless inventory and with a quicker turnaround when looking at the time toprocess a single carrier lot (or “hot lot”), and with a higher degree ofcontamination control resulting in significant advantages for the faboperator. Within the tool 18A, 18B or the tool or cell 300 may furtherhave metrology capability, processing capability, sorting capability,material identification capability, test capability, inspectioncapability (put boxes . . . ) etc . . . as required to effectivelyprocess and test substrates. As can be realized from FIG. 7, theprocessing apparatus 18A, 18B, and tool 300 may be coupled to share acommon controller environment (e.g. inert atmosphere, or vacuum). Thisensures that substrates remain in a controlled environment from tool 300and throughout the process in apparatus 18A, 18B. This eliminates use ofspecial environment controls of the FOUPs as in conventional apparatusconfiguration shown in FIG. 8.

Referring now to FIG. 7A, there is shown an exemplary fabricationfacility layout 601 incorporating features of the embodiment shown inFIG. 7. Carts 406, similar to carts 22A, 122A transport substrates orwafers through process steps within the fabrication facility 601 throughtransport chambers 602, 604, 606, 608, 610, 612, 614, 616, 618, 620,624, 626. Process steps may include epitaxial silicon 630, dielectricdeposition 632, photolithography 634, etching 636, ion implantation 638,rapid thermal processing 640, metrology 642, dielectric deposition 644,etching 646, metal deposition 648, electroplating 650, chemicalmechanical polishing 652. In alternate embodiments, more or lessprocesses may be involved or mixed; such as etch, metal deposition,heating and cooling operations in the same sequence. As noted before,carts 406 may be capable of carrying a single wafer or multiple wafersand may have transfer capability, such as in the case where cart 406 hasthe capability to pick a processed wafer and place an unprocessed waferat the same module. Carts 406 may travel through isolation valves 654for direct tool to tool or bay to bay transfer or process to processtransfer. Valves 654 may be sealed valves or simply conductance typevalves depending upon the pressure differential or gas speciesdifference on either side of a given valve 654. In this manner, wafersor substrates may be transferred from one process step to the next witha single handling step or “one touch”. As a result, contamination due tohandling is minimized. Examples of such pressure or species differencecould be for example, clean air on one side and nitrogen on the other;or roughing pressure vacuum levels on one side and high vacuum on theother; or vacuum on one side and nitrogen on the other. Load locks 656,similar to chambers 184P4 in FIG. 7, may be used to transition betweenone environment and another; for example between vacuum and nitrogen orargon. In alternate embodiments, other pressures or species may beprovided in any number of combinations. Load locks 656 may be capable oftransitioning a single carrier or multiple carriers. Alternately,substrate(s) may be transferred into load lock 656 on shelves (notshown) or otherwise where the cart is not desired to pass through thevalve. Additional features 658 such as alignment modules, metrologymodules, cleaning modules, process modules (ex: etch, deposition, polishetc . . . ), thermal conditioning modules or otherwise, may beincorporated in lock 656 or the transport chambers. Service ports 660may be provided to remove carts or wafers from the tool. Wafer orcarrier stockers 662, 664 may be provided to store and buffer processand or test wafers. In alternate embodiments, stockers 662, 664 may notbe provided, such as where carts are directed to lithography toolsdirectly. Another example is where indexer or wafer storage module 666is provided on the tool set. Re-circulation unit 668 may be provided tocirculate and or filter air or the gas species in any given section suchas tool section 612. Re-circulation unit 668 may have a gas purge,particle filters, chemical filters, temperature control, humiditycontrol or other features to condition the gas species being processed.In a given tool section more or less circulation and or filter orconditioning units may be provided. Isolation stages 670 may be providedto isolate carts and/or wafers from different process' or tool sectionsthat can not be cross contaminated. Locks or interconnects 672 may beprovided to change cart orientation or direction in the event the cartmay pick or place within a generic workspace without an orientationchange. In alternate embodiments or methods any suitable combination ofprocess sequences or make up could be provided.

Referring now to FIG. 10, there is shown an end view of an exemplarysingle axis platen drive system 320 in accordance with one embodiment.Drive system 320 is an example of a drive suitable for driving transportapparatus or carts 22A, 122A, 406 shown in FIGS. 2, 3, and 7-7A. System320 has a stationary winding set which drives platen 324. Platen 324 maybe supported on slide blocks 326 which are slideable on rails 328. Rails328 are coupled to a base 330, or side walls, of the transport chamber.Base 330 provides a barrier 332 between winding 322 and platen 324. Ascan be realized, barrier 332 may also isolate the winding 322 from theinterior environment of the chamber. Winding 322 is coupled to base 330.Platen may have magnets 334 coupled to it for interfacing the platen 324with winding 322. A sensor 336 may be a magneto-restrictive type halleffect sensor and may be provided for sensing the presence of themagnets in platen 324 and determining proper commutation. Additionally,sensors 336 may be employed for fine position determination of platen324. Position feedback device 340 may be provided for accurate positionfeedback. Device 340 may be inductive or optical for example. In theinstance where it is inductive, an excitation source 342 may be providedwhich excites winding or pattern 346 and inductively couples back toreceiver 344 via coupling between pattern 346. The relative phase andamplitude relationship used for determining the location of platen 324.A cart identification tag 347, such as an IR tag may be provided with areader 348 provided at appropriate stations to determine cart id bystation.

Referring now to FIG. 11A, there is shown an end view of platen drivesystem 400 in accordance with another embodiment. Referring also to FIG.11B, there is shown a section view of drive system 400, taken alonglines 11B-11B in FIG. 11A. As will be described further below, system400 is capable of effecting movement of a platen or cart 406 (cart 406may be similar to carts or transport apparatus 22A, 122A describedbefore). System 400 has opposing stationary winding sets 402, 404 whichdrive cart 406. Winding sets 402, 404 are wound in a two dimensionaldriving array, vertical 408 and lateral 410. In alternate embodiments,additional arrays could be provided to drive cart 406 in differentdirections, for example 427 by coupling system 400 to another similarsystem oriented 90 degrees therefrom. The arrays are driven in multiplezones in order to allow multiple carts to be driven independently. As anexample, zone 424 could be a supply zone, zone 426 could be a transferzone, and zone 428 could be a return zone. Within each zone may besub-zones which allow driving multiple carts within each zone. Inalternate embodiments, more or less zones or sub-zones may be providedin any of a number of combinations. Cart 406 is supported by the fieldsproduced by winding sets 402, 404 and is positionable in a non-contactmanner by biasing the fields between winding sets 402 and 406. Chamber412 may be provided as a barrier 414 between winding sets 402, 404 andcart 406. Windings exist in zone 416 as shown. Cart 406 may have platens418, 420 with the windings. In alternate embodiments, more or lessplatens may be provided. Arrays of sensors may be provided for sensingthe presence of the magnets in the platens or the cart or the platensfor determining proper commutation and location and for fine positiondetermination of the platens and the cart. A cart identification tag maybe provided with a reader provided at appropriate stations to determinecart id by station.

Referring now to FIG. 12, there is shown a top view of an exemplary cart229 for the processing apparatus 10 in accordance with anotherembodiment of the apparatus. Cart 229 may be similar to carts 22, 122A,406 described before and shown in FIGS. 2, 3, and 7-7A. Cart 229 isshown as being capable of transporting substrate 148 along an axial path150 and/or a radial path 152. The cart 229 is also capable of moving thesubstrate along path 154 shown in FIG. 12. Cart 229 is shown as a twodimensional system for simplicity, however in alternate embodimentsadditional axis of motion, for example, z motion (not shown—in and outof paper) or angular motion 154 could be provided. Cart 229 is shown asbeing capable of handling a single substrate 148 for simplicity.However, in alternate embodiments, additional handling could beprovided. For example, the cart may include capability to handle asecond substrate, as in the case where it is desired that a substrate beexchanged at a process module (i.e. a first, processed substrate may bepicked and a second unprocessed substrate may then be placed at the sameprocess module from the same cart 229).

Cart 229 has frame 156, end effector 158 and secondary frame 160. Slides162 constrain frame 156, end effector 158 and secondary frame 160 to beslideable relative to each other along linear path 152 either to theleft or right of frame 156 as shown. Although a linear mechanism isshown, in alternate embodiments, any suitable arm system may be usedsuch as, for example, a scara type arm coupled to frame 156 as shown inFIG. 17 and as will be described in greater detail below. Substrate 148is supported on end effector 158.

Referring now to FIG. 12A, there is shown a top view of exemplary cart229, in a portion of chamber 229 (similar to chamber 18 and 602-626, seeFIGS. 2-3, and 7-7A). The cart has the end effector 158 extended intoexemplary module 166. Module 166 may be similar to any of the modulesdescribed before as being connected to the transport chamber. Cart 229is shown as being capable of transporting substrate 148 along an axialpath 150 and/or a radial path 152. Cart 229 has frame 156, end effector158 and secondary frame 160. Slides 162 constrain frame 156, endeffector 158 and secondary frame 160 to be slideable relative to eachother along linear path 152 either to the left or right of frame 156 asshown. Frame 156 has magnetic platens 168 on its underside whichinterface with synchronous motor 170. Drive platen 172 interfaces withsynchronous motor 174. Drive platen 172 is mounted on the underside ofand slideable relative to frame 156 along direction 176 which issubstantially parallel to direction 150 by using bearings 178. Movementof platens 168 and 172 simultaneously along direction 150 allows cart tomove in direction 150 without motion in direction 152. Holding platens168 stationary while simultaneously moving platen 172 along direction176 relative to frame 156 causes a radial motion along direction 152 ofsubstrate and end effector 148, 158.

Linear motion of platen 172 in direction 176 is translated into linearmotion of secondary frame 160 along direction 152. Pulley 186 isrotatably coupled to frame 156 and has secondary pulleys 188 and 182.Pulley 182 is coupled to platen 172 with bands 184 such that movement ofplaten 172 along direction 180 causes pulley 182 to rotate in direction190 with the opposite applying in opposing directions. Pulleys 192 and194 are rotatably coupled to frame 156. Cable 196 is coupled to pulley188 at point 198, wraps around pulley 192 as shown, and terminates at200 on secondary frame 160. Cable 202 is coupled to pulley 188 at point198, wraps around pulley 188 counterclockwise, wraps around pulley 194as shown and terminates at 204 on secondary frame 160. In this manner,linear motion of platen 172 in direction 176 is translated into linearmotion of secondary frame 160 along direction 152.

Linear motion of platen 172 in direction 176 and the translated linearmotion of secondary frame 160 along direction 152 also further extendsend effector 158 in direction 152 as shown. Pulleys 210 and 212 arerotatably coupled to secondary frame 160. Cable 214 is coupled to endeffector 158 at point 216, wraps around pulley 210 as shown, andterminates at 218 on frame 156. Cable 220 is coupled to end effector 158at point 222, wraps around pulley 212 and terminates at 224 on frame156. In this manner, linear motion of platen 172 in direction 176 istranslated into linear motion of secondary frame 160 along direction 152which is further translated to further extension of end effector 158 indirection 152 as shown. In lieu of cable pulleys, the transmissionsbetween platens and end effectors may use belts, bands or any othersuitable transmission means made of any suitable materials. In alternateembodiments, a suitable linkage system may be used in place of cablepulleys to transmit motion from the platens to the end effectors.Retraction of the end effector 158, to the position shown substantiallyin FIG. 12, is accomplished in a similar but reverse manner. Further,extension of the end effector 158 to a position similar to but oppositefrom that shown in FIG. 12B is effected by moving platens 168, 172 in anopposite manner to that described above.

Referring now to FIG. 12B, there is shown an end view of cart 229 beforebeing extended into exemplary process module 166. Slides 240 constrainframe 156 to be slideable along linear path 150 as shown. Frame 156 hasmagnetic platens 168 on its underside which interface with synchronousmotor 170. Drive platen 172 interfaces with synchronous motor 174. Driveplaten 172 is mounted on the underside of and slideable relative toframe 156 along a direction which is substantially parallel to directionindicated by arrow 150 (see FIG. 12). Movement of platens 168 and 172simultaneously along direction 150 allows the cart to move in directionindicated by arrow 150 without motion in direction 152. Holding platens168 stationary while simultaneously moving platen 172 along direction176 relative to frame 156 causes a radial motion along direction 152 ofsubstrate and end effector 148, 158. Platens 172 and 168 may havemagnets that interface with motors 170 and 174. Chamber 244 may be madefrom a nonmagnetic material, for example non-magnetic stainless steeland provide a barrier 246, 248 between the motor windings and theirrespective platens. In alternate embodiments, more or less linear drivesor carts may be provided. For example, a single drive motor may beprovided having additional drive zones where platens 168 and 172 wouldinterface with the same drive motor but be independently driveable bythe different zones. As a further example, additional carts could bedriven by different drive systems in the floor 250, the walls 252, 254above in line with or below the slot openings or in the cover 256 of thechamber.

Referring now to FIG. 13A, there is shown a portion of chamber 716 ofthe apparatus 10, and a top view of an exemplary drive system 701 withan exemplary cart 700 that may be used with the apparatus. Chamber 716is another representative portion of chamber 18, or chambers 602-624 ofthe apparatus (see FIGS. 2-3, and 7-7A). Cart 700 is shown as beingcapable of transporting substrates 702A, 702B along an axial path 704and/or a radial path 706 or in a Z motion (not shown—in and out ofpaper). In alternate embodiments, angular motion could be provided. Inalternate embodiments, more or less substrate handling could beprovided. Cart 700 has transport mechanisms 724A and 724B which can be alinear mechanism or any suitable arm system may be used such as, forexample, a scara type arm. In alternate embodiments no arm may beprovided. Transport mechanisms 724A and 724B may extended into processmodules or other modules as desired in a manner similar to that shown inFIG. 12A. Cart 700 has platens 722, 720, 710 and 712 on its sides whichinterface with synchronous motors in the walls of transport chamber 716.Drive platen 712 is mounted on the side of cart 700 and is slideablerelative to cart 700 along direction 704. Platen 712 drives mechanism724A such that the movement of platen 712 along direction 704 (fromlocation 712A to 712B, see FIG. 13A) relative to cart 700 allowsmechanism 724A to transport wafer 702A between location 708A and 708Bthrough slots 718A and 718B. Similarly, drive platen 710 is mounted onthe side of cart 700 and is slideable relative to cart 700 alongdirection 704. Platen 710 drives mechanism 724B such that the movementof platen 710 along direction 704 (from location 710A to 710B, see FIG.13A) relative to cart 700 allows mechanism 724B to transport wafer 702Bbetween location 708A and 708B through slots 718A and 718B. Platens 710and 712 are independently moveable relative to cart 700. Platens 722,720 are fixed relative to cart 700. Holding platens 720, 722 stationarywhile simultaneously moving platen 712 along direction 704 causes aradial transfer motion along direction 706. Holding platens 720, 722stationary while simultaneously moving platen 710 along direction 704also causes a separate radial transfer motion along direction 706.Simultaneously moving platens 720, 722, 710 and 712 along direction 704causes cart 700 to move along direction 704—enabling the cart 700 tomove from process location to process location as through valve 714 forexample.

Referring now to FIG. 13B, there is shown a section view of theexemplary drive system 701 and cart 700 taken along line 13B-13B in FIG.13A. Referring also to FIG. 13C, there is shown another side sectionview of the exemplary drive system 701 in FIG. 13B. System 701 hasopposing stationary winding sets 727, 729 that drive cart 700. Windingsets 727, 729 are wound in a combination of one and two dimensionaldriving arrays, for example, vertical 705 and lateral 704. The drivingarrays may be linear motors or linear stepping type motors in one or twodimensional arrays. Examples of such driving arrays are described inU.S. Pat. Nos. 4,958,115, 5,126,648, 4,555,650, 3,376,578, 3,857,078,4,823,062, which are incorporated by reference herein in their entirety.In alternate embodiments, integrated two dimensional winding sets couldbe employed with platens having two dimensional magnets or patterns. Inother alternate embodiments, other types of one or two dimensional drivesystems could be employed. In alternate embodiments, additional arrayscould be provided to drive cart 700 in different directions, for exampleby coupling system 701 to another similar system oriented 90 degreestherefrom. The arrays are driven in multiple zones in order to allowmultiple carts to be driven independently. As an example, zone 685 couldbe a supply zone, zone 683 could be a transfer zone, and zone 681 couldbe a return zone. Within each zone may be sub-zones which allow drivingmultiple carts within each zone. In alternate embodiments, more or lesszones or sub-zones may be provided in any of a number of combinations.Cart 700 is supported by the fields produced by winding sets 727, 729and is positionable in a levitated and non-contact manner by biasing thefields between winding sets 727 and 729. FIG. 13C shows one possiblewinding combination that could be driven by the system shown in FIG. 13Dand employed to levitate cart 700 (as for example as discussed furtherbelow with reference to FIG. 14A, or through multiple axis activelevitation). One dimensional winding sets are provided in winding zones732A-C and 730A-C and 734A-C and 742A-B and 740A-B. Two dimensionalwinding sets are provided in winding zones 736A-E and 738A-C. Inalternate embodiments, any suitable combination of winding sets could beprovided or a full 2-D array or otherwise could be provided. Cart 700has platens 720 and 710 which may be used in combination with arrays738B for platen 720 and arrays 736B, C and D for platen 710. By movingplaten 710 in direction 704 (see FIG. 13A) and holding platen 720stationary, a wafer may be radially moved through slot 718A. Bysimultaneously moving 710 and 720 in direction 705 (see FIG. 13B), awafer may be picked or placed. By coordinating winding commutation andwinding switching between zones, cart 700 may selectively be movedvertically and/or laterally through the different winding and drivezones. Chamber 716 may be provided as a barrier between winding sets727, 729 and cart 700. In alternate embodiments, no barrier need exist,such as in the event that winding sets 727, 729 are inside the enclosure716 where there is for example a clean air or nitrogen environment. Inalternate embodiments, more or less platens or windings may be provided.Arrays of sensors 746, 747, 748 may be provided for sensing the presenceof the magnets in the platens or the platens or the cart(s) fordetermining proper commutation and location and for fine positiondetermination of the platens and the cart or for determining positions,such as the gap between platens and windings. A cart identification tag,as noted before, may be provided with a reader provided at appropriatestations to determine cart id by station.

Referring now to FIG. 14A there is shown an end view of anotherexemplary cart 760, in accordance with yet another embodiment, supportedby the fields produced by single axis linear motor winding sets 762,764. Exemplary cart 760 is positionable in a non-contact manner bybiasing 776 the fields between winding sets 762 and 764. Positionsensing 766, 768 is provided, in a close loop fashion with biasing 776,to levitate cart 760. Levitation may be accomplished in this simplemanner as the cart is passively stabilized in the Z direction as shownin FIG. 14B. Cart 760 has magnetic platens 772 and 774 on its sideswhich may have magnets or be made from magnetic or conductive materialswhich interface with winding sets 762, 764. In alternate embodiments,more or less platens could be provided, driving arms for example.Chamber 770 (similar to any representative portion of the chambers 18,602-624 of the apparatus, see FIGS. 2-3, and 7-7A) may be made from anonmagnetic material, for example non-magnetic stainless steel andprovide a barrier between the motor windings and their respectiveplatens as described before. In alternate embodiments, more or lesslinear drives or carts may be provided. For example, a single drivemotor may be provided having additional drive zones where platens wouldinterface with the same drive motor but be independently driveable bythe different zones. As a further example, additional carts could bedriven by different drive systems in the floor, the walls above in linewith or below slot openings or in the covers of the chamber.

In FIG. 14B the relationship between the restoring force F and the axialdeflection Z from the desired position of cart 760 is graphicallyillustrated. In the respective positive or negative axial direction (zdirection) the restoring force first increases in magnitude to a valueFMAX or −FMAX respectively up to a maximal deflection ZMAX or −ZMAXrespectively, but decreases again however when this deflection isexceeded. Therefore, if a force is applied to cart 760 (such as cartweight or external forces, such as from other winding sets that drivethe same or other platens or otherwise) that exceeds FMAX, then the cartescapes from the windings 762, 764. Otherwise, cart 760 will stay withinthe fields as long as they are applied. This principle, described in USpatent references (which are hereby incorporated by reference in theirentirety) U.S. Pat. Nos. 6,485,531, 6,559,567, 6,386,505, 6,351,048,6,355,998 for a rotary devices is applied in the drive system 701, ofthe apparatus described herein, in a linear fashion to levitateexemplary cart 760. In alternate embodiments, other drive systems orlevitation systems may be used.

Referring again to FIG. 13D, there is shown a diagram of an exemplarywinding drive system 790 suitable for use with cart/platen drive system701 in FIG. 13A. Winding drive system 790 has windings 792, multiplexer793 and amplifier modules 794. Windings 792 may have windings and/orsensors such as hall sensors, positions sensors, inductive sensors,carrier identification sensors, status and fault detection logic andcircuitry or otherwise. Amplifier modules 794 may have single ormultiple phase amplifiers, position and/or presence sensor inputs oroutputs, CPUs and/or memory, identification reader inputs or outputs,status and fault detection logic and circuitry or otherwise. Amplifiermodules 794 may connect directly to windings 792 or through multiplexerunit 793. When using multiplexer unit 793, amplifiers A1-Am may beselectively connected to any of windings W1-Wn. A CPU coordinates thisselective connection and monitors the status of the devices. In thismanner, the CPU may selectively take amplifier modules or windings offline for service without shutting down the tool.

As noted before, the transport apparatus or carts suitable for use inthe transport chambers 18, 602-624 (see for example FIGS. 2-3, and 7-7A)may comprise carts with or without a transfer arm for transferringsemiconductor workpieces between the cart and a desired location in theapparatus. FIGS. 12 and 13A respectively show, as described before, twoexemplary embodiments of transport carts 229, 700 with transfer arms forhandling semiconductor workpieces in the apparatus. Referring now aheadto FIGS. 22 and 23, there is shown another embodiment of a transportcart mechanism 1557 suitable for use in the chambers of apparatus 10.Cart 1557 may include base section or base plate 1558 and transfer arm1577 mounted to the base plate. As shown in FIG. 22, the cart mechanismbase plate 1558 with two coupled magnet arrays 1502 on opposite sides ofthe plate, but not limited to opposite corners of the plate. On theopposing corners of the robot base plate 1558, two addition magnetarrays 1502 are coupled to linear bearing carriages 1560 and are made toslide on linear bearing rails 1562. These linear bearing rails 1562 arecoupled to the base plate 1558. A drive belt 1564 or other means ofconverting linear motion to rotary motion is attached to the linearbearing carriage 1560. In the case shown, the drive belt 1564 is wrappedaround an idler pulley 1566 and then a pulley tensioner 1568 andattached to a drive pulley 1570. The linear motion applied to thebearing carriage 1560 through the magnet array 1502, will result inrotary motion of the driven pulley 1572. In the case of a two degree offreedom application, a redundant version of the mechanism described isapplied to the opposite side of the robot cart mechanism and a duplicatecircuit is attached to drive pulley 1572. This combination yields aconcentric pulley assembly. The relative motion between the fixed magnetarray 1502 and the combined magnet array 1502 and linear bearingcarriage 1560 provides a means of driving the transfer arm linkage. Inthe case of linear transport of the robot carriage, the linearbearing/magnet array 1560/1502 and the coupled magnet array/cart baseplate 1502/1558 are driven as a fixed set and no rotation of the drivenpulleys 1570 & 1572 is seen. The drive mechanism of base plate 1558 maybe used for operating other suitable transfer arm linkages, someexamples are shown in FIGS. 24-24C, 25-25C). The transfer arm 1577 inthe embodiment shown in FIG. 23, has a general single SCARA armconfiguration. Drive pulley 1572 is coupled to the lower link arm 1574and drive pulley 1570 is tied to forearm drive pulley 1586. The rotationmotion of the forearm pulley 1586 is coupled to the forearm 1578 throughthe drive belt 1582 and the elbow pulley 1576. The wrist/end effector1584 is driven by the resulting relative rotation motion of the forearm1578 with respect to the wrist elbow pulley 1580 as it is grounded tothe lower link arm 1574. Typically, this motion is achieved by thepulley ratio at each joint with respect to the input drive ratio ofpulleys 1572 and 1570. Referring also to FIGS. 23A-23B, the transfer armlinkage 1577 is shown respectively in retracted and extended positions.The movement between retracted and extended positions is achieved (in amanner as described above) by moving the movable magnet arrays 1502 asdesired relative to the base plate. The movement of the arm linkage maybe performed with the cart stationary or moving relative to thetransport chamber. FIGS. 23A-23B show the transfer arm 1577 positionedso that when extended the arm 1577 extends to the lateral side 1576R(i.e. the side of the cart facing a chamber wall) of the cart. This issimilar to the extension/retraction movement of the transfer mechanism724A,B of cart 700 in FIG. 13A. As can be realized, the transfer arm1577 on cart 1557 may be rotated as a unit (using movable magnet arrays1502) about axis of rotation S (see FIG. 22) to any desired orientationrelative to the cart base plate. For example, if rotated about 180° fromthe orientation shown in FIGS. 23A-23B, the transfer arm 1577 may beextended to the opposite side 1575L from that shown in FIG. 23B.Further, the transfer arm may be rotated about 90° so that the armextension is along the linear direction of the chamber (indicated byarrow 15X in FIG. 22). Any number of arm linkages may be employed withsuch a cart. Other examples of suitable arm linkages that may be usedwith the cart are described in U.S. Pat. Nos. 5,180,276; 5,647,724;5,765,983; and 6,485,250 all incorporated by reference herein in theirentirety.

FIG. 24 is an elevation view of another embodiment of the cart mechanism1557′ with dual rotary end effectors mounted to the cart base plate1558′. Cart 1557′ is otherwise similar to cart 1557 described before andshown in FIGS. 22-23. Similar features are similarly numbered. FIGS.24A-24C show the use of both linear transport and couple relative motionof the bearing carriage array as the cart is moving. As described beforewith reference to FIG. 22, the rotation of pulleys 1570′ and 1572′results from the bearing carriage and magnet array moving with respectto the fixed magnet arrays which are coupled to the cart's base plate.In the combined case, the robot cart transport is moving along thelinear chamber, in the direction indicated by arrows 15X′, and thebearing carriage and magnet array move with respect to the groundedarrays. This motion enables the end effector (s) 1588′ and 1590′ torotate thereby causing the robot end effector to extend substantiallyperpendicular to the linear direction of the cart similar to FIGS.23A-23B, described before. FIGS. 24A-24C show the end effectors 1588′and 1590′ extended to one side for example purposes. As can be realizedhowever, the end effectors 1588′, 1590′ may be extended to any side ofthe base plate. Further, the end effectors 1588′, 1590′ may be extendedto any side of the base plate. Further, the end effectors 1588′, 1590′may be extended to a position where the end effector is oriented at anangle more or less than about 90° as shown in FIGS. 24A-24C.

FIG. 25 is a schematic elevation view of still another embodiment of thecart 1557″, having and arm linkage similar to that shown in FIG. 23. Inthis case, the drive pulley 1572″ is attached to the lower link arm1592″. The driver pulley 1570″ is coupled to the end effector driverpulley 1600″ and coupled to the elbow pulley 1596″ through a drive belt1598″. The elbow drive pulley is attached to the robot end effector1594″ and provides a means of transmitting the rotation of driver pulley1570″ to the driven end effector 1594″. FIGS. 25A-25C show the cart withthe arm linkage in three different positions. FIGS. 25A-25C show the endeffector 1594″ extended to one side of the base plate 1558″ of the cartfor example purposes only. Similar to the transfer arms shown in FIGS.22-23 and 24, the transfer arm 1577″ may be rotated about axis S″ sothat the end effector may be extended/retracted in any directionrelative to the base plate 1558″ of the cart 1557″. With reference nowalso to FIGS. 2-7A, a significant advantage of using carts (such ascarts 22, 122A, 406, 229, 700, 1557, 1557′, 1557″ shown in FIGS. 12,13A, 22, 23, 24, and 25) with articulate transfer arms is that for agiven reach of the transfer arm, the transfer chamber may be providedwith the minimum width. The multi-axis articulation of the transfer armson the different cart embodiments, allows substantially independentplacement of the cart relative to the path of the articulating arm,which in turn allows the width of the transport chamber 18 to be reducedto a minimum. Similarly, the width of slot valves and passagesconnecting storage processing modules to the transport chamber may bereduced to minimum size.

Referring now to FIG. 15, an exemplary wafer aligner 500 for use withapparatus 10 is shown. The wafer aligner carrier 500 may generallyinclude two parts, wafer chuck 504 and the wafer transport carrier 502.The aligner provides wafer alignment and movement within the linearCartesian transport tool. The aligner is made to interface with thetransport cart(s) in the apparatus (such as for example carts 22, 122A,406, 700, 1557) or in some cases may be included in the robot cart ofthe linear process tool architecture.

Referring also to FIG. 16, the wafer chuck 504 is shown to be able toseparate from the wafer transport carrier 502. Friction pads may couplethe two devices during transport throughout the linear Cartesianapparatus. When disassembled, the wafer chuck 504 is free to rotate withrespect to the wafer transport carrier 502. The wafer chuck 504 providesa means of passive wafer edge support by using angle ramped wafer edgepads 508 with respect to the substrate (wafer) 506. An additionalfeature as part of the wafer chuck 504 is the relief beneath the wafer506 for the ability of the robot arm cart to remove and place the waferonto the wafer carrier 500. This is identified as wafer removalclearance zone 510.

This method of wafer rotation with respect to the linear transport cartcan be applied directly to the robot's end effector. This method isshown in FIG. 17. The robot arm cart 534 is configured so that the waferchuck 504 is removable from the robot's end effector 536. In this case,the chuck is free to be rotated to correct for any slight wafer notchorientation requirements based on drop off point changes found in theprocess modules or load locks.

Referring also to FIG. 18, the wafer chuck rotation device 532 is shown.At multiple points within the linear transport tool, these rotationalwells can be deployed. This device is based on motor isolationtechniques found in U.S. Pat. No. 5,720,590 which is hereby incorporatedby reference in its entirety. In alternate embodiments, a conventionalmotor and seal combination may be used. A stationary motor 522 ismounted to the linear transport chamber's base 530. A vacuum isolationbarrier 520 is placed between the motor armature 540 and the magnetarray 524. The magnet array is mounted directly to the rotation shaft542. This allows for direct drive coupling into the vacuum system. Apossible support bearing 518 may be required but ideally, magneticsuspension is used. An optical encoder disc 526 is attached to therotation shaft 542 with the read head 528 placed in a location toprovide position feedback to the controller for the rotation shaft's 542angle. The aligner chuck 504 is lowered onto the friction pads orkinematics pin(s) 516. These pads/pins provide a means of wafer chuck504 rotation once the wafer chuck 504 is disconnected from the wafercarrier 502 or the robot's end effector 536. This same means ofproviding rotation can be applied to control the rotational position ofa robotic arm link 538 applied as part of the robot arm carrier shown inFIG. 17.

Referring also to FIG. 19, the wafer transport carrier 500 consisting ofthe wafer chuck 504 and the wafer transport carrier is moved to aposition above the wafer chuck rotation device 532. In FIG. 20, thewafer transport carrier is lowered such that the wafer chuck 504 islifted off on the transport carrier 502. A camera 544 located in thetransport's chamber lid 546 is able to look at the image of the waferand identify the wafer's x-y position and the location angle of thewafer's notch. The wafer carrier can then be moved to provide x-ylocation change of the wafer chuck 504 with respect to the wafertransport carrier 502 and rotation can be provided to correct for notchalignment. Another option for the wafer chuck rotational drive when usedas a method of robot arm carrier device is to allow rotationalengagement while extending the robot link arm and requiring verticalaxis of motion to allow for the substrate or wafer to be lowered/raisedfrom the process module or load lock. A method of this approach isschematically shown in FIG. 21. A stationary motor 522 is mounted to aguided plate 548. The guided plate is attached to the linear transportchamber's base 530 via a metal bellows 550 or other linear isolationseal (lip seal, o-ring, etc.). A vacuum isolation barrier 520 is placedbetween the motor armature 540 and the magnet array 524. The magnetarray is mounted directly to the rotation shaft 542. This allows fordirect drive coupling into the vacuum system. A possible support bearing518 may be required but ideally, magnetic suspension is used. An opticalencoder disc 526 is attached to the rotation shaft 542 with the readhead 528 placed in a location to provide position feedback to thecontroller for the rotation shaft's 542 angle. An additional guideroller 552 and the supporting structure 554 with end of travel stop 556allow the rotation drive to be held positioned as required to engage thewafer chuck or robot arm rather than using the linear wafer transportcarrier 500 as the actuation device. In the case where the transportchamber is pressurized resulting in a state where the robot drive ispositioned up, the force of the bellows will act as a spring and allowsthe rotational device to be engaged with various linear robot arm cartvertical elevations (such as during a pick or place) but over apractical limited vertical travel range. Once the device is engaged thefriction pads or kinematics pin(s) 516. These pads/pins provide a meansof wafer chuck 504 rotation once the wafer chuck 504 is disconnectedfrom the wafer carrier 502 or the robot's end effector 536 as shown inFIG. 20. This same means of providing rotation can be applied to controlthe rotational position of a robotic arm link 538 applied as part of therobot arm carrier shown in FIG. 17.

Systems, such as those shown in FIGS. 2-7, may be controlled byconfigurable and scaleable software stored in controller C. Referringnow also to FIG. 26, there is shown manufacturing execution (“MES”)system software that may be provided in the controller C communicablyconnected to the processing system. The MES system 2000 comprisessoftware modules 2002-2016 or options that enhance the capabilities ofthe MES. The modules include a material control system (“MCS”) 2002, areal time dispatcher (“RTD”) 2004, a workflow or activity manager (“AM”)2006, an engineering data manager (“EDA”) 2008 and a computermaintenance management system (“CMMS”) 2010. The MES 2002 allowsmanufacturers to configure their factory resources and process plans,track inventory and orders, collect and analyze production data, monitorequipment, dispatch work orders to manufacturing operators, and traceconsumption of components into finished products. The MCS softwaremodule 2002 allows the manufacturer to efficiently schedule individualcarts (for example, carts 22, 122A, 406, 228, 700, 1557 in FIGS. 2-3,7-7A, 12, 13A and 22) to arrive at the processing tools to maximizeoverall system efficiency. The MCS schedules when an individual cartwill arrive at, and depart from, a specified processing tool (forexample, process 18A, 18B in FIG. 7, and modules 602-626 in FIG. 7A).The MCS manages any queuing and routing requirements at each processingtool and optimizes the system yield while minimizing the cart transportcycle time. The RTD 2004 allows manufacturers to make cart routingdecisions, in real time, based on feed back from the health of theprocessing tools. Additionally, cart routing decisions may be made bythe MES operator. The MES operator may change the priority in whichspecific products need to be manufactured. The AM 2006 allowsmanufacturers to monitor the progress of any given cart containing oneor more substrates though the entire manufacturing process. If aprocessing tool generates an error, the AM 2006 determines the bestremaining route for the all the substrates being processed at theprocessing tool. The EDA 2008 allows manufactures to analyze themanufacturing data and execute statistical process control algorithms onthat data in an effort to improve the efficiency of the processing tool.The CMMS 2010 system allows the manufacturer to predict when maintenanceis required on an individual processing tool. Variances in the processof the processing tool is monitored and compared against known processresults and changes to the process or scheduled repairs to theprocessing tool is predicted.

Referring now to FIG. 27, there is shown a substrate processing system3010 in accordance with yet another exemplary embodiment of theinvention. The system 3010 in FIG. 27 is generally similar to processingsystems and tools 10, 10′, 18, 18A, 18B, 601 described before and shownin the drawings, except as otherwise noted below. Similar features aresimilarly numbered. System 3010 generally includes substrate processingtool 3014 and in this embodiment tool interfaces 3012 and 3016. As inthe previous exemplary embodiments, tool 3018 has a controlledatmosphere and is isolated from the outside atmosphere. The toolinterfaces 3012, 3016 generally provide an interface between the tool3014 and other cooperative systems in the fab. For example, toolinterface 3012 may be an EFEM suitably configured for interaction with afab mass substrate transport system 3001, such as automated guidedvehicles, or other desired automated material handling system. The EFEM3012 may be able to allow or provide for loading and offloading ofsubstrates between the mass transport system 3001 and EFEM, and holdunprocessed substrates for entry (in the direction indicated by arrow3000S) into the processing tool 3018. The EFEM 3012 may also be capableof receiving from the processing tool 3018 (in the direction indicatedby arrow 3000P), processed substrates for return transfer to the fabtransport system 3001. As noted before, in this embodiment system 3010has another tool interface 3016, such as an environmental second endmodule (ESEM), at the opposite end of the tool 3018 from EFEM 3012. ESEM3016, in this embodiment, is substantially similar to EFEM 3012, capablefor example of receiving processed substrates from the tool 3018 (in thedirection indicated by arrow 3000P in FIG. 27) and able to facilitatesubsequent transfer of the substrates to an adjoining portion of fabtransport system 3001. If desired, ESEM 3016 may also be used to feedunprocessed substrates to tool 3018. In alternate embodiments, theprocessing system may have a tool interface at but one of the tool ends.In that case, unprocessed substrates would be input, and processedsubstrates would be output, throughout the one end of the process toolwhere the tool interface is located. In other alternate embodiments, thetool may interface or be otherwise connected directly to another tool orto a transport chamber having a controlled atmosphere (such as in amanner similar to that shown in FIG. 7A for transport chambers 602-626).Still referring to FIG. 27, tool 3018 generally comprises a substratetransport chamber 3014 and process modules 3020, 3020A. As noted before,chamber 3014 may have a controlled atmosphere such as a vacuum or inertgas and may be isolated from the outside atmosphere. Transport chamber3014 may have different sections 3014A, 3014B, 3014C, capable of beingisolated from each other such that each section may be capable ofholding a different controlled atmosphere (e.g. vacuum, near highvacuum, high vacuum). As seen in FIG. 27, the transport chamber 3014 hasa generally linear shape. The process modules 3020, 3020A are mounted inthis embodiment to the lateral sides of the transport chamber 3014. Theprocess modules 3020, 3020A may be similar or different from each other.For example, the processing tool 3018 may have one or more load lockchamber modules 3020A (in the embodiment shown in FIG. 27 there are fourload lock chamber modules 3020A, two of which communicate with each toolinterface 3012, 3016) as desired to allow transfer of substrates intoand out of the tool (in the direction indicated by arrows 3000 I/O)without affecting the controlled atmosphere in the tool. The otherprocess modules may be configured to perform desired processing onsubstrates in the tool, such as dielectric or metal deposition, etching,ion implantation, rapid thermal processing, chemical or mechanicalpolishing, metrology and others. The process modules, are connected tothe sides of the transport chamber 3018 to form a seal with the chamberand maintain the controlled atmosphere in the chamber. The processmodules 3020 may be arranged in any desired order along the chamber3014, such as for example to provide a desired serial processingsequence when substrates progress through the tool in direction 3000S.As will be described further below, tool 3018 does not limit the processsequence, to which substrates are subjected, to merely the serial orderof the process modules arrangement on the tool, but rather allowsselectability of the process steps. In alternate embodiments, theprocess modules of the tool 3018 may each provide substantially the sameprocess. As seen in FIG. 27, the tool 3018 has at least one transportvehicle or cart 3229 located in chamber 3014, and capable of holding oneor more substrates thereon. The cart 3229 is capable of linear traverseinside the chamber 3014 (in the direction indicated by arrow 3000X). Thecart 3229, as will be described below, may also have a suitable operablesubstrate transfer device 3160 for transferring substrates between thecart, inside the transport chamber 3014, and the process modules 3020,3020A (in the direction indicated by arrow 3000Y in FIG. 27). The cart3229 in this embodiment is passive, without motors or powered systems.The transport chamber 3014 includes a drive system 3400 that interfaceswith the cart to move the cart within the chamber (direction 3000X) andeffect operation of the cart substrate transfer device 3160 to transfersubstrates (indicated by direction 3000Y). The transport chamber 3014may also include a position feed back system 3336 for identifying theposition of the cart 3229 and substrate. The drive system 3400 andposition feed back system 3336 are operated by the CPU to move the cartand transfer substrates in order to select any desired process sequencefor the substrates processed by the tool. As seen in FIG. 27 thetransport chamber 3014 is formed by modules 3016, 3016A, 3016B, 3016Cthat are abutted to each other. As will be described below, each module3016, 3016A, 3016B, 3016C is a self contained unit with integral drivesystem and, position feed back system portion to allow each module tooperate as an individual transport chamber, and to allow integration ofany desired number of modules to form the transport chamber 304 ofdesired length.

The transport chamber modules 3016, 3016A, 3016B, 3016C forming thetransport chamber 3014 are generally similar to each other. Thetransport chamber modules 3016, 3016A, 3016B, 3016C may have differentlengths, and different numbers of connections for connection of anydesired number of process chamber modules to each transport chambermodule. Though in the embodiment shown in FIG. 27, each transportchamber module is capable of having a process chamber module 3020, 3020Aconnected to each side of the transport chamber module, in alternateembodiments transport chamber modules may be configured to interfacewith multiple process chamber modules similar to modules 3020. Thetransport chamber modules 3016, 3016A, 3016B, 3016C are interchangeableso that the chamber modules may be joined together in any desiredsequence to form the transport chamber.

FIGS. 28 and 29 are cross sectional views of an exemplary transportchamber module 3016 (FIG. 29 further shows portions in phantom ofadjacent transport chamber modules 3016, 3016A when abutted/mated to thechamber module 3016). As noted before, the transport chamber modules3016, 3016A, 3016B, 3016C are substantially similar. Chamber module 3016has a frame 3016F, which may be of any suitable shape and made of anysuitable material. The frame 3016F may have removable panels orsections, such as for example removable top panel 3016T. The removablepanel 3016T is mounted to the rest of the module frame 3016F to allowremoval from the module when the module is connected to other modulesforming the chamber. This allows access to components/cart inside themodule without removal of the entire module from the chamber. Accesspanel 3016T may be sufficiently large to allow insertion/removal of thecart 3229 through the resultant opening 3016O in the chamber moduleframe. A seal 3016S is provided at the interface of the panel 3016T andframe to prevent compromise of the controlled atmosphere in thetransport chamber 3014. As seen in FIG. 28, the frame has ports 3016Pformed therein for communication with the process chamber modules 3020.As may be realized, the ports 3016P are sized and shaped to allow thesubstrate transfer device 33060 with the substrate S thereon to passthrough the port into the process module. The ports 3016P may beclosable by suitable valves or doors that may be integrated into thetransport chamber module frame 3016F, or may be mounted on the processmodule. As seen in FIG. 29, the frame 3016F has suitable interfacefeatures 3016I at the opposite longitudinal ends for sealably mating themodule 3016 to adjoining modules 3016A, 3016. The interfaces 3016I maybe of any suitable type. By way of example, the interfaces 3016I mayhave suitable seating features complementing mating facets of theadjoining module interface to allow proper abutment of the adjoiningmodules. Fasteners, such as mechanical fasteners, or other suitableclamping or retention features may be included to capture the modules toeach other. The interfaces 3016I₁, 3016I₂ may include polarizationfacets to establish a desired orientation of the chamber modules 3016,3016A when being joined (and preventing abutment and connectiontherebetween when the module is not in the desired orientation) theinterface features 3016I₁, 3016I₂ are common to each module allowing themodules to be interchangeable as noted before. The frame 3016F, in thisembodiment defines a chamber space sufficient for cart 3229. Minimumclearances may be provided around the cart to allow free movement of thecart through the module. The end openings 3016R in the module frame aresized to allow the cart 3229 (holding a desired number of substrates S)to pass through the opening, and traverse between modules 3016, 3016A.The end openings 3016R may be closed by doors 3016D. The doors 3016D maybe integral with the module frame, or may be installed as an additionalmodular portion between chamber modules when the chamber modules arejoined together.

As seen in FIGS. 27-28, the module has support or guide rails 3040 forcooperating with slides 3240 on the cart, movably support the cart 3229in the chamber. In this embodiment, the rails 3040 are located on thebottom of the module (under the cart), though in alternate embodimentsthe rails may be attached to any desired portion of the chamber moduleframe. In this embodiment, two rails 3040 are shown, but more or fewerrails may be used. The rails 3040 are shown as extending continuouslythrough the module. The rails 3040 terminate at a distance 3040D fromthe interfacing face of the module 3016 sized so that, when the cartpasses between modules 3016, 3016A, the slides 3240 on the cart maytraverse the distance 3040D (in each module) and commence riding on therail of the adjacent module 3016, 3016A without disturbance to thestable attitude of the cart. Conversely, as may be realized, the slides3240 of the cart 3229 are sized to continue to provide stable support tothe cart when the cart passes between modules 3016, 3016A and the slides3240 traverse from the rails 3040 in one module 3016, 3016A to theadjoining rail segments in the adjoining module.

Still referring to FIGS. 27-28, the module 3016 has an integral portionof the cart drive system 3400. In this embodiment, the system is alinear electrical motor, though in alternate embodiments any suitabletype of electric or mechanical drive system may be used such as a cabledrive. In the embodiment shown in FIGS. 28-29, the drive system is acoreless linear drive system, such as coreless linear motors availablefrom Tecnotion or Anorad. In FIG. 29, the drive system portion integralto the transport chamber module 3016 is shown as having three sets ofwindings 3402, 3402A, 3402B, 3404, 3404A, 3404B on each side of themodule. As seen in FIG. 28 each set of windings 3402, 3404 cooperateswith a corresponding platen 3168, 3172 on the cart 3229. The windings3402, 3404 may be of any desired length, including commerciallyavailable standard lengths. In alternate embodiments, any desired numberof windings may be used to drive the cart platens on each side of thechamber. As seen in FIG. 28, the coreless motor windings 3402, 3404project into the chamber to interface with the platen 3168, 3172 of thecart. In alternate embodiments, the linear motor may be an iron corelinear motor similar to the motor 400 described before and shown inFIGS. 11A-11B. In that case, the motor windings may be isolated from thechamber by interior frame portions similar to portions 414 in FIGS.11A-11B. The windings 340L, 340SA, 3402B, and 3404, 3404A, 3404B on eachside of the module are arranged respectively along a single axis,thereby providing one drive axis on each side. In alternate embodiments,windings may be positioned to provide multiple drive axes on each side.In other embodiments, for example as in the case where iron core linearmotor windings are used, the windings may be arranged to provide driveaxes in both X and Z directions (i.e. both linear along the chamber, aswell as vertical drive axes, for shunting the cart between longitudinaldrive axes, similar to the winding arrangement described before andshown in FIGS. 13B-13C). Windings 3402-3402B, and 3404-3404B, along eachdrive axis, are also sized and positioned relative to the moduleinterface 3016I₁, 3016I₂, to maintain, in cooperation with the next mostproximate windings 3400B in the abutting module 3016, a continuouspropulsive force on the platens traversing the interface region of theabutting modules, enabling the cart to traverse from one module 3016,3016A to the other. A control system 3790, controlled by the CPU isprovided to control operation of the windings. Though in FIG. 29, onlyone set of drive axis windings 3402-3402B of the module 3016, is shownas being connected to the control 3790, both sets of windings arecontrolled in a similar manner. The winding control system 3790 isgenerally similar to winding control system 790, described before andshown in FIG. 13D. The winding control or drive system 3790, maygenerally have a multiplexer 3793 and amplifier modules 3794. Theamplifier modules 3794 may be connected via multiplexer 3793 to drivewindings 3402, 3402A, 3402B along each drive axis in the desiredsequence for moving the cart platens. The sequencing and connection ofthe amplifiers to the windings is controlled by the CPU. The CPU maycommunicate with the position feed back system 3336 of the module, aswill be described further below, to determine the amplifier connectionand drive sequence of the windings. The winding control system 3790 maybe a discrete system dedicated to the module 3016. For example, thecontrol system 3790 may be carried, mounted or otherwise incorporatedwith the module 3016 (the control system 3790 need not be positioned onthe module frame, and may be enclosed in a separate housing (not shown)if desired). The control system 3790 may communicate with the windings3402, 3402A, 3402B through suitable communication lines penetratingthrough the chamber when using suitable feed through. In FIG. 29,dedicated communication lines are shown individually passing through thecharger walls, for example purposes, and the communication lines may beconsolidated to allow a minimum number of feed through penetrations inthe chamber walls. The control system 3790 may include a suitablecoupling 3790C, allowing the control system 3790 to be connected to theCPU upon assembly of the tool. As seen in FIG. 29, the module 3016 mayhave another wiring 3401C (for example mounted or situated on a side ofthe module) for coupling the communication lines of the windings to thecontrol system 3790. Coupling 3401C may also allow the windings to beconnected to a central winding control system of the process tool in acase where a dedicated module winding control system is not desired.

Referring now to FIG. 30, here is shown a bottom view of the cart 3229.The cart may have any suitable configuration. In this embodiment, thecart is substantially similar to cart 229 described before and shown inFIG. 12-12B. As noted before cart 3229 has two platens 3168, 3172.Platens 3168, 3172 have permanent magnets or magnetic material, and areconfigured for operation with the coreless linear windings 3402, 3404 asshown in FIG. 28. Platen 3168 in this embodiment is fixedly mounted tothe cart frame 3156. Platen 3172 is movably secured, such as by keyedslides 3156S, to the frame 3156 of the cart. Platen 372 is thus capableof limited movement relative to the cart frame 3156 (in the directionindicated by arrow 3229X shown in FIG. 30). Fore and aft stops limit themotion of platen 3172 relative to the frame. Similar to platen 172 ofcart 229, described before, the additional mobility of the platen 317Lrelative to cart 3229, provide the cart with a further degree of freedomthat is converted to operate the substrate transfer device 3160 in orderto extend and retract. Substrate transfer device 3160 is substantiallysimilar to the telescoping sections 158, 160 of cart 229 (see FIGS. 12A,12B). Hence, transfer device 3160 may include any suitable number oftelescoping sections, terminating with an end effector, similar to endeffector 158 described before. The transfer device 160 may be connectedby a suitable transmission system, similar to the system of cart 229, tothe movable platen 3172 to convert the relative movement of the platento movement of the transfer device 3160 (and hence movement of thesubstrate in the direction indicated by arrows 3000Y₁, 3000Y₂ in FIG.28) (Z axis) may be generated by deenergizing/energizing the windings3402, 3404 and raising/lowering the cart to pick/place the substrate S.In alternate embodiments, the substrate transfer device of the cart maybe of any suitable type such as for example a scara type arm, having oneor more articulated sections. Further independent degrees of freedom,for independent motion of various transfer device sections may beprovided by adding additional platens to the cart that are mounted to beindependently movable relative to the cart similar to platen 3172. Inalternate embodiments, the cart may be similar to cart 1558, describedbefore and illustrated in FIGS. 22-23, or may be similar to carts 1558′and 1558″ shown respectively in FIGS. 24, 24A-24C and FIGS. 25, 25A-25C.

Referring now again to FIGS. 28-29, as noted before, the transportmodule chamber 3016 also has an integral position feed back system 3336for determining and controlling the position of the platens/cart in themodule. In the embodiment shown in FIGS. 28-29, position feed backsystem 3336S may be capable of fine precision determination, such ashaving a positioning resolution and accurately in the range of about 1-5μm. The module 3016 may have another position feed back system 3340capable of gross or rough position determination, such as having apositioning resolution and accuracy of about 10-20 μm. The fine positiondetermination system 3336 may be a linear electric encoder system.Suitable linear encoder systems are available from Netzer PrecisionMotion Sensors, Ltd., or from Farrand Corp. In alternate embodiments,the module may have any other suitable type of position determinationsystem capable of fine precision determination, such as electro-opticalencoders, or magneto-restrictive type Hau effect sensing system. In thisembodiment, the fine positioning system 3336 may include a linear scale3336S. The linear scale 3336S is mounted to the bottom surface of themodule frame 3016F to interact with passive sensor registration featuresN1-N4 (see FIG. 30) on the cart 3229. In alternate embodiments, thescale may be positioned on any other portion of the module placing thescale in a suitable position for sensing the registration features onthe cart. The scale 3336S, which is illustrated schematically in FIGS.28-29 is an electrically active element, excited from a suitable ACsource (not shown) via suitable communication line 3336C. For example,the scale may include one or more printed circuit strips on whichperiodic pattern field transmitter is printed. In this embodiment, thescale 3336S may also include a receiver capable of sensing changes inthe fields of the transmitter as the registration features on the cart3229 move along the scale. In this embodiment, the scale may extendcontinuously between the module interfaces 3016I₁, 3016I₂ at theopposite ends of the chamber module. In alternate embodiments, the scalemay extend only partially in the module, in the areas of the modulewhere fine position determination is desired. In this embodiment, thescale 3336S may include multiple sensing tracks 3336S1-3336S5, eachbeing capable of sensing the position of a corresponding sensorregistration features N1-N5 on the cart 3229. As seen in FIG. 30, cart3229 may have multiple sensor registration features N1-N5. As notedbefore, the sensor registration features N1-N5 in this embodiment arepassive (i.e. not powered) and may include magnets or magnetic material.In the embodiment shown in FIG. 30, the cart 3229 may have five sensorregistration features N1-N5 to enable positioning of the cart 3229 aswell as the movable platen. Two of the features, such as N4, N3 on theright and N1, N2 on the left, may be used for registration andpositioning respectively of the right and left sides of the cart.Feature N5 in this embodiment is used for registration of the movableplaten position. As seen in FIGS. 28 and 30, the registration featuresN1-N4, which in this case are positioned on the bottom of the cart insufficient proximity to interact with the rails 3336S1-3336S4, areoffset laterally to substantially align with the corresponding sensingtrack 3336S1-3336S4 of scale 3336S (see also FIG. 29). Also, theregistration features N3-N4, and N1-N2, used respectively for positiondetermination of the right and left sides of the cart 3229, are offsetat a longitudinal pitch 3000A sufficient for continuous positiondetermination of the cart when the cart traverses between modules 3016,3016A. For example, during passage from one module to the next, theoffset 3000A allows the rear most registration features N2, N4 tomaintain interaction with the corresponding tracks 3336S2, 3336S4 of themodule the cart is leaving until after the lead most registrationfeatures N1, N3 have commenced interaction (i.e. position determinationhas commenced) with the corresponding sensing tracks (similar to tracks3336S1, 3336S3) of the module the chart is entering. Hence, positioningof the cart 3229 is continuously established throughout the carttraverse motion within chamber 3014 (see FIG. 27). Registration featureN5 on platen 3172, allows, in cooperation with track 3336S5, forposition determination of the platen 3172 in a manner similar to thatdescribed above. A comparison o the position signals registered forfeatures N1-N4 and N5 (performed for example by the CPU) allows fordetermination of the relative position of the movable platen 3172. Therelative position information may then be used for controllingactivation of the substrate transfer device 3160 of the cart. Inalternate embodiment, the cart may have any other suitable arrangementof registration features, and may have more or fewer registrationfeatures, such as one registration feature for position determination ofeach side of the cart. In alternate embodiments, position determinationmay be achieved by a combination of rough position determination, usingcross positioning system 3340, and fine position determination withprecision positioning system 3336. For example, gross positioning system3340 (which may be any suitable position determination system such asHall effects type position sensing system or an electro-optic encodersystem, and may be less expensive to install throughout the modulechamber) may be used during general traverse motion of the cart 3229through the chamber module 3016, and also for positioning when the cartmoves from one module to another. The precision positioning system 3336may then be used in a more limited fashion, such as in cases wheregreater position determination accuracy is desired. For example, it isdesired to precisely determine the position of the cart 3229, as well asplaten 3172, when transferring substrates to the process modules 3020,3020A. Accordingly, in the case installation of the active scale 3336Smay be sized to generally coincide with the region where ports 3016P(see FIG. 27), communicating with the process modules 3020, are located.Also, a single registration feature per side, and another registrationfeature for the movable platen 3172 may be sufficient for fine positiondetermination of the cart 3229, and of the platen 3172 to enableaccurate movement of the substrate transfer device 3160. As may berealized from FIG. 29, signals from the gross and fine positiondetermination systems 3340, 3386 are communicated via suitable lines3336C, or via wireless means, for processing by the CPU, which in turnuses the position information for controlling the windings throughwindings control system 3790 (see FIG. 29). Though communication lines3336C have one or more couplings (similar to coupling 3790C) forcoupling to an off module CPU, the positioning systems 3340, 3336 of themodule are also capable of communicating directly with processors of thededicated winding control system, so that the chamber module 3016, mayautonomously, relative to the overall tool control architecture, controloperation of the windings to effect desired movement of the cart 32229and transfer device thereon.

As may be realized, each transport chamber module 3016, 3016A includessystems as described above, enabling the module to form a completetransport chamber for a processing tool. For example, the tool 3018 maybe configured to have a transport chamber 3014 of but one module,selected form the different but interchangeable module 3016, 3016A,3016B, 3016C, in a configuration similar to tool 18 shown in FIG. 5. Asshown in FIG. 27, the modules 3016, 3016A, 3016B, 3016C may otherwise bejoined, in any selected order, by abutting the common interfaces of themodules to form a transport chamber 3014, and tool 3018 of desiredconfiguration. The autonomous overability of each module 3016, 3016A,3016B, 3016C allows assembly of the tool to be effected as easily ascompletion of the mechanical connection at the module interfaces.

Referring now to FIG. 31, there is shown a schematic plan view of asubstrate processing apparatus 4010 in accordance with another exemplaryembodiment. Processing apparatus 4010 illustrated in FIG. 31, isgenerally similarly to processing apparatus 10, 10, 601 and 3010,described previously and shown in FIGS. 2-7A, 27 except as otherwisenoted. Similar features are similarly numbered. As may be realized, andsimilarly to the other exemplary embodiments illustrated in the Figures,the arrangement of the apparatus 4010 in the embodiment shown in FIG. 31is merely exemplary, and in alternate embodiments, the processingapparatus may have any other desired shape/configuration. Similar to theprocessing apparatus in the exemplary embodiments described before,apparatus 4010 generally has an interface section 4014, transportchamber section 4018 and processing/substrate holding section 4300. Theinterface section 4014 may have module(s) or section(s) 4014A, similarfor example to EFEM modules 14 (see for example FIGS. 2-3). Theinterface section 4014 may communicate with the other sections of theapparatus (such as the transport chamber section) and allowing theapparatus 4014 to interface with substrate peripheral systems, such asFAB AMHS or, manual interface, for loading/unloading substrate(s) fromthe apparatus. The number and locations of the interface sectionmodule(s) 4014A, in the exemplary embodiment shown in FIG. 31, isrepresentative, and in alternate embodiments there may be more or fewerinterface modules located in any desired positions of the apparatus. Thetransport chamber section generally includes a transport chamber 4018.Transport chamber 4018 may be generally similarly to transport chambers18, 18A, 18B and transport chamber 3014 described before and shown inFIGS. 2-7A and 27. The processing/substrate holding section maygenerally have one or more substrate processing/holding modules, as willbe described further below, communicably connected to the transportchamber 4018 of the apparatus to allow substrate transfer directionthere between. In the exemplary embodiment, the transport chamber 4018may have a selectably variable length and shape. The transport chamber4018 in the exemplary embodiment show in FIG. 31, may be modularlyformed from transport chamber modules, similar for example to transportchamber modules 18P1-18P4 (see FIG. 7), that may be serially connectedlinearly or in a two dimensional or three dimensional array, (as will bedescribed further below) to form the transport chamber. As shown in FIG.31, in the exemplary embodiment, the transport chamber 4018 may beextended and arranged to run through a FAB, similar for example to theFAB facility layout 601 of the exemplary embodiments shown in FIG. 7A.As noted before, the transport chamber 4018 (as well as the overallapparatus) arrangement is merely exemplary and in alternate embodimentsthe transport chamber may have any other desired arrangement. Inalternate embodiments, the transport chamber may for example be arrangedin accordance with inter bay and intra bay organization scheme (in whichprocesses may be organized according to process “bays”; the associatedtransport chamber section, similar to chamber 18A in FIG. 7, may bereferred to as an “intra-bay” section, and the intermediate sections ofthe transport chamber, linking the “intra-bay” sections, may be referredto as “inter bay” sections). The versatility inherent in the processingapparatus 4010, and its transport chamber 4018 as previously describedand as will be described in greater detail below, enables what may bereferred to as an organic arrangement of processes (e.g.processing/holding modules 4300) and the associated transport chamberwithin the FAB as illustrated in the exemplary embodiment shown in FIG.31 (see also FIG. 7A). In other alternate embodiments, the transportchamber modules may be arranged to form a transport chamber similarly totransport chamber 18 shown in FIG. 5. The transport apparatus 4010 mayalso have a linearly distributed transport system 4400 capable oftransporting, through the chamber, substrate from the interface sectionmodules 4014 to the processing section a modules and between processingsection modules and returning processed substrates to the interfacesection modules for off loading. The transport chamber may have one ormore transport paths through a given cross section. In the exemplaryembodiment the transport system may have one or more cart(s) 4406,similarly to casts 22A, 27A, 406 described before. In the exemplaryembodiment cart(s) 4406 (for example along one, two or three directionalaxes) may be independently propelled through the transport chamber bylinear motors. For example, the linear motors of the transport system4400 may be brushless as linear motors, in section linear motor(s)consists of iron core linear motors, linear stepper motors) or any otherdesired type of linear motor. The linear motors may have winding setssimilarly to winding sets 402, 404 (see FIG. 11A) or to winding sets770A, 770B, 770C (see FIGS. 13B-13C0 disclosed in the side walls of thetransport chamber. The linear motor may also have winding sets similarlyto winding 322 (see FIG. 10) or windings 340L, 3404 (see FIG. 28). Inalternate embodiments, the cart may be driven by any suitable drivesystem. In other alternate embodiments, the linearly distributedtransport system may have any desired configuration.

The transport chamber 401B may be changeable or isolated atmosphereableisolated from outside atmosphere. Load locks, for example integral tothe transport chamber similar to the load locks 18P4 (see FIG. 7), orotherwise communicably connected to the transport chamber, interfacebetween the isolated atmosphere within the transport chamber, orisolated portions thereof, and substrate modules (for example EFEMmodules of interface section 4014) or holding stations exposed tooutside atmosphere. In the exemplary embodiments shown, the transportchamber 4018 may have different internal atmosphere(s) along its length,for example corresponding to the various processes disposed along thelength of the transport chamber. The processes shown in the exemplaryembodiment depicted in FIG. 31 are representative and similar generallyto the processes in FAB 601 shown in the exemplary embodiment depictedin FIG. 7A and described before. For example, processes may includeepitaxial silicon (EPI), dielectric deposition or photolithography,etching, ion implantation or rapid thermal processing, metrology,dielectric deposition and others. Correspondingly, sections of thetransport chamber may for example have different gas spheres on premisesor may be in vacuum (e.g. roughing or high vacuum levels). The transportchamber in the exemplary embodiment may have load lock modules 4656allowing communication between different sections of the transportchamber holding different atmospheres without compromise of therespective atmospheres. Load lock modules 4656 may be similar to loadlock modules 656 (see FIG. 7A), with isolation valves 4654 that allowthe carts 4406 to travel through the load lock module from one transportchamber section with one gas species/pressure (e.g. vacuum, nitrogen,argon) to another transport chamber section with a different gasspecies/pressure. Load lock modules 4656 may be capable of transitioninga single cart or multiple carts 4406. Multiple carts 4406 may be arrayedin the load lock 4656 along one linear transport path (e.g. cartsserially queued on path) or on more than one transport path (e.g.laterally stack) as will be described further below. Similar to the FABlayout 601, of the exemplary embodiment shown in FIG. 7A, other locks orinterconnects 467L may be provided in the transport chamber for exampleto change cart orientation and/or direction, and/or elevation of knowtransition between intersecting sections 4602, 4612, 4604 of thetransport chamber. As noted before, FIG. 31 schematically illustrates aplan view of the apparatus 4010, and though elevation differences arenot apparent in the illustrated embodiment, it should be realized thatsections of the transport chamber 4018 of the processing modules 4300 orof the interface section 4014 may be at different elevations. Forexample, the processing modules/substrate holding stations, as shown inFIG. 31, may be arrayed in plan along the transport chamber 4018, but inthe exemplary embodiment the processing module and holding stations mayalso be vertically arrayed and/or located at different elevations alongthe transport chamber as will be described further below.

Still referring to FIG. 31, and as noted before, in the exemplaryembodiment the transport chamber 4018 may form multiple transport pathsalong which carts 4406, and hence substrates carried by the carts, maybe transported in one or more of the linear sections 4602, 4604, 4612,4620, 4624, of the transport chamber. In FIG. 31, two transport paths A,R are illustrated schematically as being axially offset. Similar topreviously described exemplary embodiments (for example see FIG. 13C)and as will also be further described below, axial offset between thetransport paths A, R may be sufficient to allow carts moving along thepaths through a given cross section of the transport chamber 4018 topass each other. In the exemplary embodiment, the transport paths may bevertically offset. As may be realized, in the exemplary embodiments, thetransport paths are defined, at least generally, by the linear motorwindings positions in or on the transport chamber walls as previouslydescribed. In FIG. 31, two transport paths A, R are shown for examplepurposes, and in alternate embodiments more or fewer transport paths maybe disposed in one or more of the linear sections of the transportchamber. In other alternate embodiments, the paths may have any othersuitable axial offsets. In the exemplary embodiment, at least one of thetransport paths A, R may be positioned so that carts positioned on thepath can access the interface section 4014 processing or modules 4300mated to the transport chamber (e.g. to effect substrate transfertherebetween). One or more of the transport paths may be a bypass lane,allowing carts to pass by stopped carts in the chamber. In the exemplaryembodiment, the transport paths A, R may be capable of allowing carts4406 bidirectional movement on each path. Controller C may define atransport path A, R or a desired portion thereof (for example transportpath A in transport chamber section 4602, 4612A) as having a singletransport direction. For example, path A in chamber 4602 may be definedby controller C as an advance path, moving carts and (in FIG. 31 to theleft) from loading/unloading section 4014, and path R may be defined asa return path (towards section 4014). Thus carts, and their substrates,may be moved away from load/unload station 4014 on path A, to transportsubstrates to process modules 4630 along the transport chamber 4602. Thecarts 4406 may bring substrates (for example after processing) toload/unload station on path R. Switching or connecting paths, similar tovertical paths 705 (see FIG. 31C) in the transport chamber 4602 mayserve to transfer carts between paths. As may be realized, path R may beused to bypass carts stopped on path A, such as when carts are stoppedto access process modules 4630, and conversely path A may be used tobypass blocked portions of path R, such as when carts are stopped onpath R to access those process module(s) 4630 that may be accessed fromtrack R. By way of further example, in the exemplary embodiment path Ain transport chamber 4612 may have a controller defined transportdirection away from interconnect module 4672 (see FIG. 31) and path Rmay have its direction defined towards module 4672. Hence, carts 4406for example may move substrates from module 4672 (as may be realized inthe exemplary embodiment carts may bring substrates such as from loadingmodule 4014 to module 4672 along path A of chamber 4602) to the processmodules 4631 and/or load and unload station 4014B on path A of chamber4612. Carts 4406 may be moved towards module 4672 on path R. As notedbefore, in the exemplary embodiment, interconnect module 4672 may allowcart(s) 4606 to change direction/orientation in order to transit via themodule 4672 between transfer chamber section (e.g. 4602 to 4612 or 4604and vice versa). In alternate embodiments, the interconnect module mayoperate as a substrate pass through, for example substrates beingtransferred from carts to connection module, and from module to othercarts in adjoining transport chamber sections. As seen in FIG. 31, thetransport direction defined by controller C on a transport path mayextend for a portion of the transport chamber linear section. Differentportions of a given transport path A, R within a linear section of thetransport chamber may have different defined directions. For example,within transport chamber section 4612A, the defined direction of path Ais away from module 4672, and the defined direction of path R is towardsmodule 4672. In the other portions of transport chamber 4612, the pathdirections may for example be reversed. As noted before, interconnectingtransport paths (not shown) may allow carts 4406 to transit betweenpaths. (e.g. to reverse travel direction or continue in the samedirection in the case where the defined direction along one pathreverses/switches). The controller C may define the direction of thetransport path(s) A, R, or portions thereof, according to the processbeing performed by processing modules on the respective transportchamber section and in order to effect optimum substrate FAB times andreduce WIP, within the apparatus and family. For example substrates maybe loaded in the apparatus in one loading station and unloaded in adifferent unloading station. For instance, in the exemplary embodimentshown in FIG. 31 the controller C may further be programmed to routesubstrates to effect optimum processing. Processed substrates (that mayhave been loaded in apparatus 4010 via loading station 4014A) may betransported along path A (e.g. in the direction away from module 4672)or along path R (e.g. in a direction towards module 4672) for unloadingfrom load/unload station 4014B. In alternate embodiments, the transportpaths may have any desired transport direction.

Referring still to FIG. 31, in the exemplary embodiments, the transportchamber of the processing apparatus, may include supplement transportchamber(s) or passage(s) 4570. The supplement transport passage(s) 4570operate to generally supplement the transport capacity of transportchamber 4018 as will be describe further below. In the exemplaryembodiment, the transport passage(s) 4570 may be operated as expresstransit passage(s) or chamber(s). The term express refers generally tosubstantially uninterrupted transit between departure and destinationstations, bypassing intermediate stations. In alternate embodiments, thesupplement transport passage may be operated in any other desired mannerto supplement the transport capacity of transport chamber 4018 (e.g.shunt, buffer, etc.) In the exemplary embodiment shown in FIG. 31 thetransport passage 4570 is connected at desired locations to thetransport chamber 4018 and also to one or more tool interfaces 4014. Thetransport passage 4570 may have a transport shuttle(s) or vehicle(s)4571 capable of traversing the length of the transit passage. Theshuttle 4571 may be capable of holding substrate(s) or a substratecarrier(s), and transporting the substrate(s) or carrier(s) through thelength of the transit passage 4570. In alternate embodiments thetransport passage may be configured to allow carts similar to carts 4406to transit the transport passage. The transport passage 4570 may be alinearly elongated tube or tubes, each capable of holding an isolatedatmosphere, such as N₂ or vacuum, or may have an atmosphere of highlyclean air, that may be circulated through a desired filtration. In theexemplary embodiment shown in FIG. 31, the transport passage 4570includes a passage tube 4572, schematically depicted for example asextending generally along the transport chamber section 4612. Inalternate embodiments, each transport chamber section 4602, 4604, 4612,4608 may have a complementing transport passage similar to passage tube4572. In the exemplary embodiment shown, the transport passage also hasa passage tube 4573 shunting between transport chamber sections 4612 and4608. In alternative embodiments, the supplemental transport passage mayhave another desired passage tubes. The transport passage 4570 in theexemplary embodiment shown, has interconnect passages 4576, 4578 (twoare shown for example purposes and in alternate embodiments there may bemore or fewer interconnection passages) connecting the passage tube 4572to the desired modules 4656, 4658 of the transport chamber 4018. In theexemplary embodiment shown, interconnect passage tube 4576 may be joinedto an intermediate loadlock (LL) module 4656, and another interconnectpassage tube 4578 may be joined to another LL module 4658 located, inthe exemplary embodiments, at the end of the linear portion 4612 of thetransport chamber. In alternate embodiments, the interconnect passage(s)may be joined to any desired portion of the transport chamber, such as atransport chamber module 4518 that is not a loadlock. As may berealized, other passage tube(s) 4573 of the transport passage 4570 maybe connected to corresponding portions of respected transport chambersections 4612, 4608 via similar interconnect passages. In the exemplaryembodiment, other interconnect passage tube(s) 4575 may join passagetubes 4572, 4573 to each other. The passage tube to passage tubeinterconnects may have suitable means to change directions and/ororientation of vehicle(s) 4571 to transit between passage tubes. Inalternate embodiments the passage interconnects may have a transfersystem capable of transferring substrate(s) or carrier(s) betweenvehicles in adjoining passage tubes. In other alternative embodiments,passage tubes may not be directly interconnected, but may communicatevia separate connections between passage tubes and correspondingsections of the transport chamber. The interconnect passage tubes may besized to allow passage of one or more substrates between the transportchamber 4018 and transport passage 4570. A transfer system (not shown)for moving the workpieces between the transit passage and transportchamber through the interconnect passages may be provided in the transitpassage or transport chamber as will be described in greater detailbelow. The transport passage 4570 may be located in any desired positionrelative to linear transport chamber 4018 to allow the interconnectpassages to be joined to the transport chamber. For example, thetransport passage tubes 4572 may be located above, along side or underthe transport chamber section 4612. The interconnect passages may bemated to any desired workpiece transit openings of the transport chambermodules, such as side openings similar to the closable openings 718A(see FIG. 13C) or closable top openings in the transport chambermodules. The transit openings may be closed by suitable valves (similarto slot valves 4654 for side openings) to isolate the transport chamberatmosphere from the transit passage. In alternate embodiments, thetransport passage tubes may have any other desired orientation, such asbeing angled relative to the transport chamber. In the exemplaryembodiment shown in FIG. 31, the transport passage has a passage(s) 4574(one is shown for example) that communicates with tool interface section4014A to allow workpiece(s) to be loaded/unloaded from shuttle 4571 fromthe interface section 4014A. As may be realized, the shuttle 4571 may becapable of substantially uninterrupted movement within transportpassage(s) 4570 between for example interface section 4014A andinterconnect passages 4576, 4578 and may thus transit substrates in thecontrolled atmosphere of the transport passage between interfacesection(s) 4014A and the interconnect passages 4576, 4578, or betweenpassages 4576, 4578 thereby allowing the substrates to bypass transportthrough portions of the transport chamber 4018. In the exemplaryembodiment, the passage tubes 4572, 4573 or the transport tube 4570 mayhave a common atmosphere and transit times through the transport passagemay not be affected by atmosphere cycling times. Accordingly, transittime between desired station may be shorter via transport passage 4570compared to transport chamber 4018. Moreover, by bypassing portions ofthe transport chamber 4018 throughput of the processing tool 4010 may beincreased and WIP may be reduced. By way of example, turnaround time,such as from one interfacing station 4014, for “hot lots” may bereduced. For instance, a single workpiece (“hot lot”) carrier may beloaded, by a FAB AMHS (not shown), at tool interface section 4014A wherethe “hot lot” substrate(s) are to be processed at processing modules4031. The substrate(s) may be picked, by a suitable transfer system(such as an indexer in the interface section), from the interfacesection 4014A and placed onto shuttle 4571. The shuttle 4571 may transitthrough passage 4570 to interconnect passage 4576 and the workpiece maybe loaded, by another suitable transfer system (now shown) to load lock4656. Hence, the workpiece is expressed from the loading location to aportion of the tool 4010 proximate to the desired processing steps. TheLL 4656 may be cycled to allow one or more cart(s) 4406 of the transportsystem 4400 access to the substrate(s) from shuttle 4571. For examplethe indexing system may move substrates from shuttle to cart. Theworkpiece may be moved through the transport chamber 4612 by cart 4406and loaded and unloaded from the desired processing modules 4631 forprocessing. Upon completion of the desired processing, the workpiece maybe located, for example, near the LL to which interconnect passage 4578is connected. Accordingly, the workpiece may be transported in transportchamber 4612 to this LL for loading onto shuttle 4571. The LL may becycled to facilitate access for loading the processed workpiece unto theshuttle 4571 in the transit passage without compromise of the differentatmosphere in the transport chamber 4612. The shuttle 4571 may expressthe processed workpiece to a desired location, such as tool interfacesection 4014A (via passage 4574) or interface section 4014B (via passage4576) for loadout. In alternate embodiments, the express transit passagemay have any desired length and configuration, and may communicate toallow workpiece transfer with any desired portion of the processing tool510 including for example metrology, workpiece stocker (WS) or carrierstocker (CS) sections, lithography sections 4634, etc.

Referring now to FIG. 32, there is shown a schematic elevation view of arepresentative portion of a processing apparatus 5010 in accordance withanother exemplary embodiment. The representative portion of theprocessing apparatus 5010 may be representative of and similar toportions of apparatus 4010 shown in FIG. 31. Similar features aresimilarly numbered. The representative portion illustrated in FIG. 32has a linear chamber portion 5012 of a transport chamber 5018 similarfor example to linear section 4012 of transport chamber 4018 shown inFIG. 31. The confirmation of the exemplary embodiment shown in FIG. 32is merely exemplary and in alternate embodiments, any other suitableconfiguration may be employed for the illustrated portions of theapparatus. In the exemplary embodiment, the transport chamber 5012 isschematically illustrated as communicating with interface sections5014A, 5014C (similar to interface sections 4014A, 4014B, 4014C, seeFIG. 31). In the exemplary embodiment, the interface sections 5014A,5014C may be located for example purposes at ends of the transportchamber sections 5012, and in alternate embodiments the interfacesections may be located at one or more intermediate locations along thetransport chamber (for example, similar to connection of interfacesection 4014B to chamber 4012 in FIG. 31), and the transport chamber maycommunicate with more or fewer interface sections. In the exemplaryembodiment, the transport chamber 5012 is schematically illustrated ascommunicating substantially directly with the interface sections, thoughin alternate embodiments the transport chamber may communicate throughintervening transport chamber sections that may offset the interfacesections both horizontally and vertically from the linear portion of thetransport chamber (see for example interface section 4014A related totransport chamber 4012 in FIG. 31). The transport chamber in theillustrated embodiment is formed from representative transport chambermodules 5018P1, 5018P2. The transport chamber modules 5018P1, 5018P2 maybe generally similar to each other and to modules 4018P1, 18Pa, 18P2shown in FIGS. 7 and 31 also described previously. In the exemplaryembodiment shown in FIG. 32, transport chamber modules are illustratedas having similar lengths for example purposes, and in alternateembodiments transport chamber modules may have different lengths andshapes. For example, as also noted before, transport chamber modules5018P1, 5018P2 (similar to modules 18P1, 18P2) may be of various lengthscapable, for example, of accommodating one or more transport cartsserially queued along the transport chamber length (FIG. 32 shows onetransport cart 5406 in a transport chamber module for example purposes).In the exemplary embodiment transport chamber modules 5018P1, 5018P2 mayhave different heights similar to the exemplary embodiments describebefore, the transport chamber 5018 (or a portion thereof 5012) is formedby joining the transport chamber modules serially in order to form thetransport chamber of desired length and shape. As may be realized,similar to previously described embodiments, transport chamber length5018 or a portion thereof 5012) may be varied by adding or removingtransport chamber modules. The arrangement of the transport chambermodules in transport chamber section 5012 is exemplary, and in alternateembodiments the transport chamber modules may have any other desiredarrangement along the transport chamber.

In the exemplary embodiment, each transport chamber module may includean integral portion of the distributed transport system 5400 (transportsystems 5400 may be generally similar to transport systems 4400described before and shown in FIG. 31). As shown in FIG. 32, in theexemplary embodiment each transport chamber module 5018P1, 5018P2 maydefine one or more transport lanes that form substantially continuoustransport paths A, R, R′, throughout the transport chamber 5012, fortransport cart(s) 5406 when the modules are assembled to form thetransport chamber. In the exemplary embodiment cart(s) 5406 may besimilar to carts 406, 4406 described before. The travel lanes in thechamber modules, and the paths formed thereby in the transport chambermay be varied. For example, in the exemplary embodiments shown in FIG.32, transport chamber modules 5653, 5656, may have three transport lanesL1, L2, L3, transport chamber modules 5657, 5660 may have two lanes L5,L6, and modules 5656A, 5656B, 5655A, 5659B may have one lane L7. (It isnoted that reference numerals 5653, 5656, 5657, 5656A, 5656B, 5659A,5659B, 5660 in FIG. 32 identify transport chamber modules as specific tothe reference frame of the transport chamber of the exemplary embodimentshown, and reference numerals 5018P1, 5018P2 identify transport chambermodules when referred to generally.) In alternate embodiments, thetransport chamber modules may have more of fewer transport lanes.

As noted before, the module transport lanes L1, L2, L3, L5, L6, L7combine to form the substantially continuous longitudinal transportpaths A, R, B. For example, as shown in FIG. 32, lanes L2 (in modules5653, 5656) and L5 (module 5652, 5660) and L7 (modules 5656A, 5655A)combined form path A. Similarly path R, R′ and B may be formed in thecorresponding sections of the transport chamber 5012. In alternateembodiments, different portions of the transport chamber may have moreor fewer paths and any desired path arrangement. In the exemplaryembodiment, the side walls (referred to generally with referencenumerals 5716 in FIG. 32) may be similar to sidewalls of chamber module716, shown in FIGS. 13A-13C. Winding sets in the side walls 5716 maydefine the travel lanes within the respective modules of the transportchamber. In the exemplary embodiment, each of the transport chambermodules may be communicably connected, for example by a suitable “plugand play” type coupling (as will be described further below) tocontroller C. The controller C, as noted before, has programming thatoperably integrates the discrete winding sets, and hence travel lanes,of the individual transport chamber modules to form the transport pathsfor cart(s) 5406 throughout the desired portions of the transportchamber 5018/5012. As noted before, and as will also be describedfurther below, the controller may polarize (or define specific) traveldirections along portions of the transport paths A, R, R′, B. As may berealized, in a given transport chamber module where a travel lane isundesired, the winding sets (see form example FIG. 13C) corresponding tothe undesired travel lane, may be de-energized by the controller.Conversely, winding sets corresponding to desired travel lanes may beenergized and controllably operated by the controller to move thecart(s) 5406 (or cart platens) as previously. Hence, the travel lanes ofthe transport chamber modules may be varied. In alternate embodiments,the transport chamber module travel lanes may be formed in any suitablemanner (see for example FIGS. 10, 12B, 28).

In the exemplary embodiment shown, modules 5653, 5657, 5659A, 5659B mayhave closable side openings 5180O for communication with processingmodules/substrate holding stations (not shown). The side openings 5180Omay be generally similar to wall openings 180, 18A, 18B describedpreviously (see also FIGS. 2, 13A-13C), sized to allow substratetransfer between transport chamber and mated processing module by anydesired means (for example, transfer with cart mounted arm, see FIGS.22-25; or transport arm in processing module, or transport arm intransport chamber independent from cart, or by cart transiting throughthe opening). The openings may be controllably opened/closed by slotvalves, or other suitable valves/doors, to avoid compromise of theinternal atmosphere of the transport chamber module. The valves areconnected to and controlled by the controller, for example via “plug andplay” coupling 5720. The number and arrangement of side openings 5180Oin the transport chamber modules shown in FIG. 32 is merely exemplary,and is alternate embodiments more or fewer openings may be provided.Undesired openings may be covered with a blank. As noted before,openings 5180O, 5180O′ 5180O″ for communicating with processing modulesarrayed along side the transport chamber may be positioned relative tothe transport lanes to allow transfer of substrates from/to the cart(s)5406. For example, transfer openings 5180O′, 5180O″ in module 5653 maybe respectively positioned relative to lanes L2, L3, and opening 5180Oin module 5657 may be positioned relative to transport lane L5. In theexemplary embodiment, the substrate transfer openings in the transportchamber may be considered to correspond to desired transport lanes, andhence transport paths of the transport chamber. For example, openings5180O, 5180O′ may be correspond to path A, and opening 5180″ to path R(path B may be a bypass path). Accordingly, as may be realized, theprocess modules of the apparatus may be connected to desired transferopenings 5180O′, 5180O″, 5180O of the transport chamber according to adesired process protocol to be established (by the controller) alongdesired paths. Conversely, the transport directions of the transportpaths in the chamber may be defined by the controller based on theprocess module arrangement. In alternate embodiments, some combinationof this may be used. In the exemplary embodiment, path A may have adefined direction (for example) away, from interface section 5014A,(interface section 5014A is being used as a reference point relative tothe transport path directions only for ease of description, and anysuitable reference location may be used), path R may have a defineddirection towards section 5014A, path R′ may be polarized away fromsection 5014A. Path B in the exemplary embodiment is, as noted before abypass path, and is shown as being bidirectional, though in alternateembodiments the bypass path may be polarized to a specific direction. Inthe exemplary embodiment shown in FIG. 32, interconnecting verticalpaths V may be provided in the transport chamber (see for example FIG.13C) allow transport cart(s) 5406 to switch between longitudinal pathsA, R, R′. As may be realized, the controller may apply different processprotocols to substrates, for example loaded at interface station 5014A,via transport along the different transport paths. If desired for aspecific lot, one or more transport path directions may be changed toestablish still other process protocols.

In the exemplary embodiment shown in FIG. 32, transport chamber modules5653, 5657, 5659A, 5659B may have different internal atmospheres (gasspecies/pressures) from each other. In the exemplary embodiment, modules5656, 5656A, 5656B may be loadlock chambers allowing carts to transitbetween the chamber modules with different atmospheres (via isolationvalves 5654, similar to valves 4654 in FIG. 31.) For example, theloadlock may be provided with a vacuum or roughing pump 5030V such asavailable from Helix Technology Corp., for evacuating the atmosphere ofthe loadlock. When the isolation valves 5654 are closed, therebyisolating the loadlock 5656 from the adjoining chamber modules (e.g.chamber modules 5653, 5657) the atmosphere in the loadlock may be pumpeddown independent of the modules. A controllable vent line (not shown)between module(s) and loadlock 5656, 5656A, 5656B may allow controlledventing between module(s) and loadlock(s). In the exemplary embodiment,the vacuum pump 5030V may also be used to simultaneously evacuate theatmosphere of one or more transport chamber modules 5653, 5657, 5656A,5656B and loadlock 5656. For example, the isolation valves 5654 may beopen and pump 5030V draws vacuum in the desired transport chambermodule(s) via the loadlock 5656. Accordingly, in the exemplaryembodiment a loadlock of variable size or capacity is formed. Inalternate embodiments, any other desired transport chamber module may beprovided with a vacuum pump so that any transport chamber module,including those with substrate transfer openings (similar to isolationvalve opening 5180O) may operate as a load lock. As noted before, one ormore of the load lock modules 5656, 5656A, 5656B, (in alternateembodiments any one or more of the transport chamber modules, as alsopreviously described with reference to the exemplary embodiments inFIGS. 7A and 31) may incorporation one or more additional features(similar to modules 658, 4658 see FIGS. 7A and 31) such as substratealignment, metrology, substrate cleaning or processing such as substratethermal conditioning, substrate buffering or any other desired featuresthat may be applied to substrates in the transport chamber 5018. In theexemplary embodiment, load lock module 5656 may be provided with thermalconditioning capability for raising or lowering the temperature of asubstrate, such as a substrate held by cart 5406 in the load lock,between an ambient temperature and a desired temperature (e.g. anoperating temperature of one or more processing modules.)

As noted before, the transport chamber modules in the exemplaryembodiment, may be provided with a “plug and play” capability via forexample coupling 5120, allowing the controller C to automaticallyrecognize a specific transport chamber module, and desired parameters ofthe module (including for example processing modules connected to thetransport chamber module) when the module is connected to the transportchamber and the controller C. For example, the coupling 5120 of thetransport chamber module, may have a suitable interface, forcommunicating with controller C, provided with integral programming toautomatically provide the “plug and play” capability on connection ofthe respective interface to the controller. For example, the couplingand interface may be configured and a USB port an connector. Mating ofthe coupling 5120, for example to a suitable port in bidirectionalcommunication with the controller, may cause the interface toautomatically identify to the controller C the module configuration, forexample module 5653 is transport chamber module, with (M) travel lanes,the winding sets defining the travel lanes, and the control parametersfor the drive section motors, and control instrumentation,identification and control parameters for any other controllable systemresident on module 5653, position of module with respect to a desiredreference frame (e.g. M^(th) module of transport chamber). Theinformation, which is downloaded automatically by controller C on matingwith the interface of coupling 5120 may provide the controller withsystem information and control parameters for all controllable systemsof the module being controlled by controller C to enable the controllerto communicate and control operation of the module's controllablesystems substantially immediately on connection of the coupling. Theinformation may also provide the controller C with the geometricparameters defining the transport “space” of the transport chamber 5012,incorporating the specific transport chamber module(s) 5653, 5656, 5657for establishing the kinematic equations and commands controllingtransport motions. For example, the downloaded information may allow thecontroller to establish the spatial coordinates (X, Y, Z) of variousfeatures, such as location of substrate transfer openings (See FIG. 32)and isolation valves 5654, 5576, chamber boundaries, center of substratepick, place positions, etc. As may be realized, the informationprogrammed into interface module/controller of coupling 5120 may be buta portion, or an identifier, sufficient to enable the controller to lookup/read the information from a memory location (not shown) of thecontroller where the control information may have been preprogrammed. Byway of example, the controller may be programmed with lookup tables oran algorithm establishing the X,Y,Z coordinates for kinematic relevantfeatures such as the locations of substrate transfer openings, modulechamber walls for transport chamber modules. Upon coupling, theinterface of a given module, may provide an indication to the controllerthat (M) module is being coupled to other modules of the transportchamber, for example already registered by the controller, causing thecontroller to access (via for example the lookup tables/algorithm) thedesired characteristics of the module.

In alternate embodiments, the module interface may be programmed withany other desired information to be downloaded by the controller oncoupling. Upon registering that (M) transport chamber module is coupled,the controller C may further automatically access, or automatically makeavailable to an operator corresponding programming to initialize therespective operable systems/components and query status of the varioussystems (e.g. slot valves open/shut, transport encoders position, etc.).Similarly, the controller C may automatically lookup and initializesuitable test protocol to verify that the systems (hardware, software)of the added module are operating nominally and if desired actuatemodule systems to bring them to a “zero” position. In addition, thecontroller may enable display features (not shown), for exampleindicating to an operator the addition of the module, the presentconfiguration of the transport chamber and tool, as well as commandprotocol allowing entry of operator commands, via a desired userinterface, to operate the systems on the added module or modifyworkpiece process protocol carried out by the tool to incorporate thenewly available features from the added module. For example, onregistration of the coupling of the transport chamber module, thecontroller may add or enable features on the display (not shown)schematically representing the module and its relative position in thetransport chamber with respect to other modules as well as presence andstatus of any module systems. Also enabled may be user selectablefeatures such as “soft keys”, for initializing test programs, orteaching programs (e.g. fine teaching programming for arm 26B) for themodule systems. As may be realized, any desired user interfacearchitecture may be employed, and in alternate embodiments more or fewerfeatures may be enabled by the controller at coupling. The downloadedinformation may be used by the controller MES system software (See FIG.26) to configure or reconfigure factory resources and process plans inorder to maximize overall system efficiency.

Still referring to FIG. 32, substrates may be loaded into the transportchamber 5012 from any interface section 5014A, 5014C. In the exemplaryembodiment, each of the interface section 5014A, 5014C may have multiplesubstrate transfer planes T1-T5 along which substrates may betransferred (loaded/unloaded) between interface section and transportchamber. In the exemplary embodiment shown the transfer planes T1-T5 maybe vertically offset. As may be realized, the interface section(s)5014A, 5014C may have a suitable indexer (not shown) to index substratesto and from the desired transfer plane. One or more transfer planes maybe substantially aligned with one or more of the transport paths A, R,R′ of the transport chamber 5012. In alternate embodiments, transferpaths for loading/unloading substrates between interface section andtransport chamber may be horizontally offset (e.g. horizontallyarrayed). An exemplary process protocol may transfer substrates frominterface section 5014A, for example along transfer plane T1 (though inalternate embodiments any transfer plane may be used) to the transportchamber. As may be realized, one or more substrate(s) may besimultaneously transferred (e.g. vertically stacked) along a giventransfer plane. Substrate transfer may occur via a load lock (not shown)located for example between transport chamber module 5653 and interfacesection 5014A. In alternate embodiments, the interface section may haveload lock capabilities, or may hold a vacuum or other desired gasspecies/pressure conforming to the internal atmosphere of transportchamber module 5653. In the exemplary embodiment, the substrate(s) maybe transferred to a cart 5406 (for example with a pick from the robotarm on the cart) on transport path A (in alternate embodiments the cartmay be on any desired transport path). In the exemplary embodiment,carts may be queued prior to positioning for receiving substrate(s) fromthe interface section 5014A on another transport path (e.g. path R orbypass path B). As noted before, cart(s) may be moved between transportpaths A, R, B by interconnects V. In the exemplary embodiment, the cartmay move the substrate(s) on path A which as noted before may have apolarized direction (e.g. away from interface section 5014A) by thecontroller in accordance with the desired process protocol. For example,the substrate(s), in accordance with the process protocol, may beprocessed in processing module(s) connected to transfer opening 5180O′.If further processing is desired, the substrate(s) are moved, via loadlock 5656, to chamber module 5657 for processing in the process moduleaccessed via the transfer opening 5180O. Processing of the substrate(s)may be similarly continued as the substrate(s) are transported alongpath A. The substrate(s) may be for example thermally conditioned(heated/cooled) to desired temperature in the load lock 5656, and mayundergo alignment or metrology testing or other desired processing inthe transport chamber according to the capabilities of the transportchamber modules. If unloading of the substrate(s) at interface section5014C is desired, the substrate(s) may continue on path A to the chambermodule 5660 for transfer along a desired transfer plane T4 to theinterface section 5014C. If processing of the substrate(s) is desiredaccording to protocols provided along path R, R′ the cart may move frompath A to path R, R′ for processing the substrate(s) therein along thosepaths. Bypass path B, may be used in the exemplary embodiment to bypassblocked portions of the transport paths A, R and “jump over” processsteps or intervening traffic along the other paths. In the exemplaryembodiment, the bypass path B may be used either to advance substratesfrom the interface section(s) or when returning or bringing substrate(s)to the interface section. The controller may variably designate one ormore of the paths A, R, R′, B a bypass path for some period of timedepending on existing and predicted traffic conditions along giventransport paths.

In the exemplary embodiment shown in FIG. 32, the apparatus has asupplemental transport passage 5570. The supplemental transport passage5570 in the exemplary embodiment may be similar to supplementaltransport passage 4570 described before and shown in FIG. 31. Similarfeatures are similarly numbered. In the exemplary embodiment shown inFIG. 32, the supplemental transport passage may have a passage tube 5572with one or more shuttle(s) 5571 capable of transiting the tube. Thetube 5572 in the exemplary embodiment may be connected by suitableinterconnects 5574, 5574′ (similar to interconnect tube 4574, see FIG.31) to the interface section 5014A, 5014C on the transport chamber. Inalternate embodiments, the passage tube may be connected to more orfewer interface sections on the transport chamber. The passage tube 5572may also communicate via interconnects 5576, 5578 (similar tointerconnects 4576, 4578, see FIG. 31) to transport chamber modules 5656and 5660. In alternate embodiments, the passage tube may be connected tomore or fewer transport chamber modules or transport chamber locations.As noted before, in the exemplary embodiment, chamber module 5656 may bea load lock. Chamber module 5660 in the exemplary embodiment may also bea load lock. Isolation valves (that may for example be integral to thechamber modules 5656) isolate the load locks from the passage tube, andin the exemplary embodiment the passage tube 5572 may have a differentatmosphere (e.g. controlled air) than one or more of the transportchamber modules. In the exemplary embodiment, passage tube 5572 may bemodular allowing the tube length to be variable and easily conformableto desired length. In alternate embodiments, the transport chambermodules may have integral tube sections, so that assembly of the modulesto form the transport chamber results in formation of the passage tube.As may be realized from FIG. 32, in the exemplary embodiment,substrate(s) may be expressed by shuttle(s) 5571 in passage tube 5572,away from interface section 5014A, 5014C to intermediate and/or distalsections or modules of the transport chamber 5012, and vice versa. Thus,substrate(s) may be introduced in the process stream at a distance orremote location from the interface section 5014A that receives thesubstrate carrier from outside the apparatus. A suitable indexingmechanism (not shown) that may be provided on the shuttle (e.g. hoist)or the transport chamber or any other suitable place, may index thesubstrates between shuttle and stations (not shown) in the transportchamber from which the cart(s) can pick/place substrates. In alternateembodiments, the indexer may be capable of direct substrate transferfrom shuttle to cart and vice versa. The isolation valves to the passagetube 5572 may be opened to allow substrate transfer between transportchamber and passage tube, and isolation valves 5654 to other portions ofthe transport chamber may be closed. In the exemplary embodiment, theexpressed substrates delivered to load lock 5656 may be heated tooperating temperature in the load lock as described before. From theload lock the substrates may be processed according to the desiredprotocol. Processed substrates may be expressed from a remote locationto a desired interface section 5014A, 5014C in a similar but oppositemanner. By way of example, a processed substrate(s) located in chambermodule 5659B (see FIG. 32) may be transported to load lock 5660, indexedthrough the isolation valve to the shuttle 5571 in passage tube 5572,and expressed to interface section 5014A. In alternate embodiments, thesubstrate(s) may be transported and processed with the apparatus in anyother desired manner.

Referring to FIG. 33, there is shown a schematic elevation view ofanother representative portion of a processing apparatus 6010 inaccordance with another exemplary embodiment. The representative portionof apparatus 6010 shown in FIG. 33 may be similar to processingapparatus 4010, and the representative portion of apparatus 5010 shownrespectively in FIGS. 31, 32. Similar features are similarly numbered.In the exemplary embodiment shown in FIG. 33, the apparatus may have atransport chamber 6018, with a section thereof 6012 connected tointerface sections 6014A, 6014C, 6014C′. The configuration shown in FIG.32 is merely exemplary and in alternate embodiments, any other suitableconfiguration may be employed. For example, one or more of the interfacesections may be located at an intermediate position along the transportchamber, alongside or inline with the transport chamber. The interfacesection 6014A, 6014C, 6014C′ may be similar to the interface sectionsdescribed before. In the exemplary embodiment shown, interface sections6014C, 6014C′ may be vertically stacked, and may be parted from eachother by a suitable partition. Each interface section 6014C, 6014C′ mayhold an atmosphere isolated from the other. For example, interfacesection 6014C′ may hold a vacuum or a desired gas species, and interfacesection 6014C may be an environmental interface module. The transportchamber 6012 may be formed from transport chamber modules similar tomodules 6018P, 5018P2 (See FIG. 32). In the exemplary embodiment,modules 6572 are prearranged to define an express or bypass passage 6570(akin to supplemental transport passage 4570, 5570 shown in FIGS. 31 and32). In the exemplary embodiment shown in FIG. 33, the express passage6570 may be integrated into the transport chamber, though in alternateembodiments some separation may be provided between the express passageand other corresponding portions of the transport chamber. As notedbefore, the modules 6572 forming the express passage of the transportchamber may be similar to other transport chamber modules 6653, 6656,6657. Thus, the express passage modules 6572, in the exemplaryembodiment, may have integral transport lanes that form transport pathsBA, BR through the express passage that can be used by transport carts6406. Though integral to transport chamber 6012, in the exemplaryembodiment, the passage 6570 may be partitioned by suitable means (e.g.floor/wall/ceiling) from adjoining modules of the transport chamber.Accordingly, the express passage may maintain an atmosphere (e.g.filtered air, inert gas, vacuum) different from the atmosphere(s)maintained in other modules of the transport chamber. In the exemplaryembodiment, the express passage modules are illustrated without transferopenings in side walls for example purposes. In alternate embodiments,the express passage modules may be provided with closed or closableaccess openings (similar for example to openings 6180O in FIG. 33) forsubstrate transfer. In the exemplary embodiment the controller maydefine, may define in accordance with temporal status conditions of theapparatus 6010, one or more of the suitable tube sections formed in thetransport chamber by the module architecture into one or morebypass/express passages. By way of example, the controller may,according to its programming, review the status and expected operationof the apparatus, and identify a tube section similar to passage 6572 ofthe transport chamber that is not being used (for some desired period oftime) for substrate processing. The passage may be connected to desiredinterface sections and desired transport chamber modules in order toallow the passage to be efficiently operated as an express passage.Accordingly, the controller may establish the identified tube section asan express passage and operate it in a manner similar to passage tube5572 (see FIG. 32). The selection may be made by the controller, ifdesired, in real time and used for example for a temporal “hot lot”. Theexpress passage selected may thus be different for different lots atdifferent times. The location of the express passage 6578 shown in FIG.33 is exemplary and as may be realized, in alternate embodiments, theexpress passage may be located anywhere in the transport chamber modulestack. The express passage may be sandwiched between transport chambermodules as shown in FIG. 33. In other alternate embodiments, the expresspassage may extend horizontally along one or more transport chambersection or be horizontally sandwiched between such sections. In theexemplary embodiment, the express passage may communicate with othermodules (e.g. load locks 6656, 6660) via suitable isolation valves 6576.Valves 6576 may be sized to allow the cart(s) 6406 to travel throughbetween express passage and other portion of the transport chamber. Inalternate embodiments, the load lock module may be located in theexpress passage. In the exemplary embodiment, an indexing system (e.g. amechanical indexer 6700) may be positioned to transfer carts betweenload lock 6656 and express passage. Other modules 6572, 6660 of thetransport chamber may have suitable drive motors to define interconnectpaths I as shown in FIG. 33 for directly motivating the cart(s) in andout of the express passage. Substrate processing may be performed in amanner similar to that previously described.

It should be understood that the foregoing description is onlyillustrative of the invention. Various alternatives and modificationscan be devised by those skilled in the art without departing from theinvention. Accordingly, the present invention is intended to embrace allsuch alternatives, modifications and variances which fall within thescope of the appended claims.

1. A substrate processing apparatus comprising: a transport chamber,capable of holding an isolated atmosphere isolated from an outsideatmosphere, and defining more than one stacked substantially linearsubstrate transport paths extending longitudinally along the transportchamber between opposing walls of the transport chamber, the more thanone stacked substantially linear substrate paths being stacked one abovethe other; a generally linear array of substrate holding modulesalongside at least one of the opposing walls of the transport chamber,each communicably connected to the chamber, through the at least one ofthe opposing walls, to allow passage of a substrate between transportchamber and holding module, the substantially linear substrate transportpaths extending along the at least one of the opposing walls; and asubstrate transport located in and movably mounted to the transportchamber for transporting the substrate along the more than one stackedsubstantially linear substrate transport paths, the substrate transporthaving at least one transporter capable of holding and moving thesubstrate; and a substrate transport drive operably connected to thesubstrate transport, and having a drive motor for moving the transporterin at least two substantially orthogonal directions, the twosubstantially orthogonal directions respectively effecting travel alongand between the more than one stacked substantially linear substratetransport paths, the at least one transporter translatably interfacing awall of the transport chamber for moving along at least one of the morethan one stacked substantially linear substrate transport paths, and thedrive motor being fixedly mounted to the wall; wherein the transportchamber has interfaces for mating with other substrate holding modulesat opposite ends of the transport chamber, each interface having anopening through which at least one of the more than one stackedsubstantially linear substrate transport paths extends, and thetransport chamber has a selectably variable longitudinal length betweenthe interfaces.
 2. The apparatus according to claim 1, wherein theselectably variable longitudinal length allows the longitudinal lengthof the transport chamber to be selectably changed between a firstpredetermined length and a second predetermined length.
 3. The apparatusaccording to claim 1, wherein the length of each of the more than onestacked substantially linear transport paths is selectably variable,path length variability being set with variance of the transport chamberlongitudinal length.
 4. The apparatus according to claim 1, wherein themore than one stacked substantially transport paths are verticallyoffset from each other.
 5. The apparatus according to claim 4, whereinthe more than one transport paths extend substantially continuouslythrough the transport chamber between the interfaces.
 6. The apparatusaccording to claim 1, wherein the at least one of the more than onestacked substantially linear transport paths is located in a portion ofthe transport chamber capable of holding a chamber atmosphere isolatedfrom another portion of the transport chamber through which the morethan one stacked substantially linear transport paths extend in thetransport chamber.
 7. The apparatus according to claim 6, wherein theportion and the other portion of the transport chamber are arrangedlongitudinally along the more than one stacked substantially lineartransport paths.
 8. The apparatus according to claim 6, wherein theportion and the other portion of the transport chamber are offsetvertically from each other.
 9. The apparatus according to claim 1,wherein the transporter is a one touch transporter capable oftransporting the substrate from one of the substrate holding modulesarrayed alongside the transport chamber to another of the substrateholding modules arrayed alongside the transport chamber without touchingthe substrate more than once.